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Products

• Application Developer Kit
• BNO085/BNO086
• Ceva ClearVox AFE
• CEVA NeuPro-S
• Ceva WhisPro
• CEVA-Bluebud
• Ceva-BX1™
• Ceva-BX1™ for sound
• Ceva-BX2™
• Ceva-BX2™ for sound
• Ceva-ClearVox ENC
• Ceva-MotionEngine™
• Ceva-NeuPro Studio
• Ceva-NeuPro-M™
• Ceva-PentaG RAN™
• Ceva-PentaG2™
• Ceva-RealSpace®
• CEVA-SenslinQ
• Ceva-SensPro2™
• CEVA-TeakLite 4™
• CEVA-TL410
• CEVA-TLS100 Subsystem
• Ceva-Waves Bluetooth Platforms
• Ceva-Waves Dragonfly
• Ceva-Waves Links™
• Ceva-Waves UWB
• Ceva-Waves Wi-Fi Platforms
• Ceva-X1
• CEVA-X2
• CEVA-X2
• Ceva-XC12™
• Ceva-XC16™
• Ceva-XC22
• CEVA-XC323
• Ceva-XC4500™
• CEVA-XC5
• Ceva-XM4™
• Ceva-XM6™
• Data in Picture
• FSM300/FSM305
• FSP200
• FSP201
• Sensor Fusion Chips and Modules
• Smart and Connected Development Platform
• Wide Angle Imaging

Resources

• 2016 Annual Report
• 2017 Annual Report
• 2018 Annual Report
• 2019 Annual Report
• 3D Audio technology and emerging applications for immersive listening experience
• 3D Audio technology and emerging applications for immersive listening experience – Webinar presentation
• 5G Mobile & Infrastructure eBook
• 5G NR base-stations redefine the SDR paradigm – webinar presentation
• 8 New Use Cases for Handheld Motion Control
• AI & Computer Vision eBook
• Arm Cortex-M7 Processor in Sensor Fusion
• ARM Powered Sensor Fusion Hillcrest
• Asus Zenfone 3 Zoom smartphone – Real-time Image Enhancement Video
• Asus Zenfone 3 Zoom Smartphone Video
• Audio & Voice eBook
• Audit Committee Charter
• Bluetooth Auracast™ Broadcast Audio Demo
• Bluetooth Channel Sounding Demo
• BNO08X Datasheet
• BNO08X Development Kit for Nucleo – Quick Start Guide
• BNO08X Development Kit Product Brief
• BNO08X Evaluation Board Schematic
• BNO08X Migration Guide
• BNO08X Product Note
• BNO08X Sensor Calibration Procedure
• BNO08X Tare Function Usage Guide
• Bridge Firmware for Nucleo
• Camera and IMU Frame Alignment in AR/VR Systems for Different Gyroscope Specifications
• CDNN Product Note – Chinese
• Ceva & ASTRI joint NB-IoT demo
• Ceva 5G Life
• Ceva and NextChip Demonstration of a Flexible, Cost-effective ADAS Solution
• Ceva Bluebud explainer video
• Ceva Bluebud presentation overview
• Ceva Bluebud Product Brief – Chinese
• Ceva Bluebud product brief – English
• Ceva Bluetooth Product Brief – Chinese
• Ceva Ceva-NeuPro Studio2 live demonstration
• Ceva Company Profile
• Ceva Company Profile – Chinese
• Ceva Company Profile – Japanese
• Ceva Company Snapshot
• Ceva Company Snapshot – Japanese
• Ceva Demo ClearVox and WhisPro
• Ceva FIRST TO LAUNCH 802.11AX IP – Linley Microprocessor report
• Ceva NeuPro-M Intro Jan 2022
• Ceva NeuPro-M Product Note – Chinese
• Ceva PantaG-RAN Presentation
• Ceva PantaG2 Presentation
• Ceva PentaG – Holistic IP Platform for Cellular Baseband Processing
• Ceva PentaG-RAN Product Note – English
• Ceva PentaG2 5G RedCap Demo
• Ceva PentaG2 Lite Baseband Platform for 5G RedCap and Cellular IoT Demo
• Ceva SAS 3.0 Product Note- English
• Ceva SATA Solution – English
• Ceva SensPro – Product Note – Chinese
• Ceva SensPro Introduction
• Ceva Targets Wearables – IP Platform Provides Main Elements for Always-On Devices
• Ceva Telegraphs 5G Intent with XC12 – Microprocessor Report
• Ceva ToolBox Software Development
• Ceva ToolBox Software Development – Chinese
• Ceva True Wireless Earbuds – Whiteboard
• Ceva Upgrades NB-IOT Platform – Linley Microprocessor Report
• Ceva Voice-control enabled solutions for IoT
• Ceva WhisPro Product Note – Chinese
• Ceva WhisPro Product Note – English
• Ceva Wi-Fi Product Brief – Chinese
• Ceva’s 2023 Investors & Analyst Day Presentation
• Ceva-BX Product Note – English
• Ceva-BX1 for sound – Product note
• Ceva-BX1 for sound – Product note – Chinese
• Ceva-BX1 Product Note – English
• Ceva-BX2 for sound – Product note
• Ceva-BX2 for sound – Product note – Chinese
• Ceva-BX2 Product Note – English
• Ceva-Dragonfly NB2 Product Note – Chinese
• Ceva-NeuPro Studio Graph Complier Demo
• Ceva-NeuPro Studio Product Note – English
• Ceva-NeuPro Studio Product Note – Japanese
• Ceva-NeuPro-M Product Note – English
• Ceva-NeuPro-M Product Note – Japanese
• Ceva-PentaG2 Lite Product Note – English
• Ceva-PentaG2 Max Product Note – English
• Ceva-RealSpace Ambient Product Note – English
• Ceva-RealSpace Elevate Product Note – English
• Ceva-RealSpace Personal Product Note – English
• Ceva-RealSpace Product Note – English
• Ceva-SensPro2 – Product Note – English
• Ceva-SensPro2 Introduction
• Ceva-TeakLite-4 DSP Family Product Note – English
• Ceva-Waves Bluetooth Product Brief – English
• Ceva-Waves Bluetooth Product Brief – Japanese
• Ceva-Waves Dragonfly Presentation
• Ceva-Waves Dragonfly Product Note – English
• Ceva-Waves UWB Modem IP Demo for Accurate Range and Angle Measurement
• Ceva-Waves Wi-Fi Product Brief – English
• Ceva-Waves Wi-Fi Product Brief – Japanese
• Ceva-Waves™ Links – Product Note – English
• Ceva-Waves™ Stream 802.11ac Wave3 SDM White Paper – English
• Ceva-Waves™ UWB – Product note
• Ceva-Waves™ UWB Radar for Human Presence Detection in Automotive Video Demo
• Ceva-Waves™ UWB – Product note – Chinese
• Ceva-X1 Controls Cellular IoT Devices – Microprocessor Report
• Ceva-X1 Introduction
• Ceva-X1 IoT processor and Ceva-Waves Dragonfly solution
• Ceva-X1 Product Brief – Chinese
• Ceva-X1 Product Brief – Japanese
• Ceva-X1 Product Note
• Ceva-X2 Controls Multiple PHYS – Mobile Chip Report
• Ceva-X2 Product Note for sound – Chinese
• Ceva-X2 Product Note for sound – English
• Ceva-XC MIMO Maximum Likelihood Detector MLD – White-Paper
• Ceva-XC12 introduction
• Ceva-XC12 Multi-gigabit SDR Processor – Product Note
• Ceva-XC12 Multi-gigabit SDR Processor – Product Note – Chinese
• Ceva-XC16 introduction
• Ceva-XC16 Product Note – Chinese
• Ceva-XC16 Product Note – English
• Ceva-XC22 Product Note – English
• Ceva-XC323 Product Brief
• Ceva-XC4500 DSP Product Note
• Ceva-XC4500 DSP Product Note – Chinese
• Ceva-XC5 / Ceva-XC323 Presentation
• Ceva-XM4 Imaging and Vision DSP Named Best Processor IP of 2015 – Microprocessor report
• Ceva-XM4 Product Note – English
• Ceva-XM4 Sharpens Computer Vision – Microprocessor Report
• Ceva-XM4 White Paper
• Ceva-XM6 5th Generation Vision Platform Presentation
• Ceva-XM6 Accelerates Neural Nets – Microprocessor Report
• Ceva-XM6 Product Note – Chinese
• Ceva-XM6 Product Note – English
• Ceva-XM6 Product Note – Japanese
• ClearVox Product Note – Chinese
• ClearVox-AFE Product Note – English
• ClearVox-ENC Product Note – English
• ClearVox-ENC Product Note – Japanese
• Code of Conduct and Business Ethics
• Company Profile eBook
• Compensation Committee Charter
• Corporate Governance Guidelines
• Cursor Design Considerations for the Pointer-Based Television – Design Note
• Designing for Handheld Motion Control
• EDACafe interview about Ceva’s latest AI/ML Processor Architecture
• Edge AI Sensing eBook
• Efficient Implementation of Neural Networks
• Fortrix™ Product Note – English
• Freespace MotionStudio
• Freespace MotionStudio 2
• FSM-9 – Product Brief
• FSM-9 Datasheet
• FSM30X 2D Drawing
• FSM30X Connection with Nucleo
• FSM30X Datasheet
• FSM30X Product Note
• FSM30X Quick Start Guide with Nucleo
• FSM30X Tare Function Usage Guide
• FSP200 Datasheet
• FSP200 Development Board Schematics (1000-4186)
• FSP200 FTDI Board Schematics (1000-4167)
• FSP200 Product Brief
• FSP200 Reference Module Schematics (1000-4174)
• FSP200 RVC Data Logging
• FSP200 Serial USB Adapter Quick Start Guide
• FSP200 Tare Function Usage Guide
• FSP201 Datasheet
• FSP201 Development Kit for Nucleo Quick Start Guide
• FSP201 Development Kit Product Brief
• FSP201 Development Kit Schematic
• FSP201 Module Quick Start Guide
• FSP201 Module Schematic
• FSP201 Module with USB Quick Start Guide
• FSP201 Module with USB Schematic
• FSP201 Product-Note
• Governance Documents View Ceva, Inc. Corporate Bylaws – 2017
• Governance Documents View Ceva, Inc. Corporate Bylaws – 2018
• HCOMM Reference Manual
• Immervision Data-In-Picture for Electronic Image Stabilization (EIS) Markers
• Immervision Infinite Possibilities Immervision Adaptive Dewarping
• Improving Sensor Fusion Output Efficiency with Arm Helium Technology
• Linley Microprocessor Report: Ceva and Synopsys Spin More TOPS
• Linley microprocessor report: Ceva Bluebud streams wireless stereo
• Linley microprocessor report: Ceva Bluebud Streams Wireless Stereo – Chinese
• Linley Microprocessor Report: Ceva NeuPro Accelerates Neural Nets
• Linley Microprocessor Report: Ceva PentaG Adds AI to 5G Baseband
• Linley microprocessor report: Ceva SensPro Fuses AI and Vector DSP – Simplified Chinese
• Linley microprocessor report: Ceva SensPro Fuses AI and Vector DSP – Traditional Chinese
• Linley Microprocessor Report: Ceva Tackles Unstructured Sparsity
• Linley microprocessor report: Ceva XC16率先实现5G布局
• Linley microprocessor report: Ceva XC16領先5G部署
• Linley Microprocessor Report: Ceva-NeuPro-M Enhances BF16, FP8 Support
• Linley microprocessor report: Ceva-SensPro Fuses AI and Vector DSP
• Linley microprocessor report: Ceva-SensPro2 Doubles AI Throughput
• Linley microprocessor report: Ceva-XC16 Stays Ahead of 5G Rollout
• Linley Microprocessor Report: Ceva-XC20 Enables Vector-Unit Sharing
• Linley Microprocessor Report: Ceva’s BX Hybrid Boosts DSP Engine
• Linley Microprocessor Report: Ceva’S PentaG2 Reduces 5G Power
• Linley Microprocessor Report: Ceva’S PentaG2 Reduces 5G Power – Chinese
• Linley Microprocessor Report: PentaG-RAN IP Targets Base Stations
• Low Latency Motion Sensors for AR/VR
• Microprocessor Report – Ceva-TeakLite4 Illuminates Roadmap
• Motion Sensors for Low-Latency 3D Audio Head Tracking – Application Overview
• MotioneEngine Mobile – Product Note
• MotionEngine Air – Product Note
• MotionEngine Hear – Product Note
• MotionEngine Product Line Overview
• MotionEngine Product Note – Chinese
• MotionEngine Product Note – Japanese
• MotionEngine Robotics – Product Note
• MotionEngine Scout – Product Note
• MotionEngine SmartTV – Product Note
• MotionEngine Wear – Product Brief
• MWC 2018 Barcelona- PentaG demo
• MWC 2020 Virtual Booth PentaG Demo
• MWC Smart Doorbell demo
• Navigating the Complexities of Robotic Mapping – WhitePaper
• NB-IoT System and Method for Radio Cell Synchronization – White Paper
• NeuPro-S Product Note – Chinese
• NeuPro-S Product Note – English
• Nominations and Governance Committee Charter
• On-Demand Webinar: Driving Forward with UWB Radar: Enhancing Child Safety in Automotive
• Overcoming Connectivity Standard Fragmentation Using a Software-Defined Modem
• PentaG – Product note – Chinese
• PentaG – Product note – English
• PentaG Presentation
• PentaG2 Lite Product Note – Chinese
• PentaG2 Max Product Note – Chinese
• PentaG™ AI Processor for CSI Reporting in 5G NR – White Paper
• Pointing on TV: A Comparative Study of touch vs. motion
• Real-Time CNN Object Recognition Video
• Real-time Face Detection Neural Network Video
• Real-Time Face Landmark – Driver Drowsiness Detection Video
• Real-Time Face Recognition Video
• Real-time Tiny Yolo Neural Network Video
• Real-Time Video HDR Video
• Robot Odometry Testing and Analysis – White Paper
• Samsung RVC case study
• Sensing & Audio Software eBook
• Sensor Hub Transport Protocol
• SH-2 Reference Manual
• SH-2 SHTP Reference Manual
• Smart Home Gateway demo
• State-of-the-art 360 Degree Technology Video
• Supporting the development of AI application systems with increasing customization by providing cores and tools – Japanese
• The 1st High Quality True Stereo Audio streaming over Bluetooth low energy
• The Most Advanced, Most Adopted Bluetooth IPs Available
• The New Ceva-X
• The Ultimate Deep Learning & Artificial Intelligence Platform for Low-power Embedded Devices
• The World Isn’t Flat for Robot Cleaners
• Unlocking the Robotic Cleaner of Tomorrow
• Using IMUs and Sensor Fusion to Unlock Smarter Motion Sensing
• UWB Human Presence Detection Video Demo
• Voice Interfaces of the Future: Tech That’s Turning Sci-Fi into Reality – webinar presentation
• Webinar presentation – Enhancing the TWS User Experience with Sensor Fusion
• Webinar Presentation : Cost effective 5G for the IoT
• Webinar Presentation: Deep Learning on Embedded Systems: 7 minutes could save you 7 months or more of hand porting and optimization
• Webinar Presentation: Driving Forward with UWB Radar: Enhancing Child Safety in Automotive
• Webinar presentation: Enabling Mass Market ADAS Applications using real-time vision systems
• Webinar Presentation: Hassle-free Bluetooth 5 SoC design
• Webinar Presentation: Low Power Wi-Fi for IoT – Fast and Easy Design of Low Power Wi-Fi SoC for IoT
• Webinar presentation: Turnkey solution for Bluetooth true wireless stereo earbuds and speakers
• Webinar Presentation: Wireless headset technologies and trends – the proliferation of in-ear Active Noise Control
• Webinar: 3D/Spatial Audio: How To Overcome Its Unique Challenges To Provide A Complete Solution
• Webinar: 5G NR base-stations redefine the SDR paradigm: How Ceva-XC12 solves the daunting computing and latency challenges of 5G NR
• Webinar: Challenges of Vision Based Autonomous Driving & Facilitation of An Embedded Neural Network Platform
• Webinar: Cost Effective 5G for the IoT
• Webinar: Deep Learning on Embedded Systems: 7 minutes could save you 7 months or more of hand porting and optimization
• Webinar: Enabling mass market ADAS applications using real-time vision systems
• Webinar: Enhancing the TWS User Experience with Sensor Fusion
• Webinar: Hassle-free Bluetooth 5 SoC design
• Webinar: How LTE Cat-NB1 (NB-IoT) is Driving Cellular SoC Design Innovation
• Webinar: Low Power LTE for IoT: Ubiquitous Coverage with Extended Battery Life
• Webinar: Low Power Wi-Fi for IoT – Fast and Easy Design of Low Power Wi-Fi SoC for IoT
• Webinar: Spot-On Dead Reckoning for Indoor Autonomous Robots
• Webinar: Turnkey solution for Bluetooth true wireless stereo earbuds and speakers
• Webinar: Using IMUs and Sensor Fusion to Effectively Navigate Consumer Robotics
• Webinar: Voice Interfaces of the Future: Tech That’s Turning Sci-Fi into Reality
• Webinar: Wireless headset technologies and trends – the proliferation of in-ear Active Noise Control
• Webinar: 适用于室内自动机器人的精确航位推算
• WhisPro Product Note – Japanese
• Wi-Fi in wearable / IoT
• Wi-Fi IPs and Platforms
• Wireless Baseband Evolution – Multiple Design Approaches for 4G Mpdems
• Wireless IoT eBook

Partners

• Actions Semiconductor
• Actt
• Advanced Bionics
• AIC Semiconductor
• Alango
• Alchip
• Almalence
• Altek
• AmbiQ Micro
• ArcSoft
• Aricent
• Arkamys
• ARM
• ArrayComm
• Arteris
• Artosyn
• ASPEED
• ASR Microelectronics
• ASTRI
• Atmosic
• Autotalks
• Beken
• Bestechnic
• Bluetooth SIG
• BlueX
• boAt Lifestyle
• Bongiovi Acoustics
• Bosch
• Brite Semiconductor
• Broadcom
• Car Connectivity Consortium
• Celeno
• Ceragon
• ChipEstimate
• Cipia
• Cirrus Logic
• CMX Systems
• Computer Vision Systems (CVS)
• CSEM
• Cyberon
• DeepGlint
• Design And Reuse
• Deutsche Telekom
• Dialog Semiconductor
• Digital Voice Systems
• Digitalwave
• Dirac
• Dolby
• DSP Concepts
• DSP Group
• DTS
• Elipticlabs
• Ellisys
• Embedded Vision Alliance
• Enea
• ENOT.ai
• Espressif Systems
• ESWIN
• FiRa
• fluent.ai
• FotoNation
• FreeRTOS
• FujiFilm
• Fujitsu
• Galileo Satellite Navigation
• GCT Semiconductor
• GF
• Global Wireless Technologies
• GMV
• Goodix
• GUC
• iCatch
• Icom
• Idea! Electronic Systems
• iFLYTEK
• Immervision
• InPlay Technologies
• Intel
• Intel
• Inuitive
• Invensense
• IRIDA Labs
• iRobot
• Itron
• IWPC
• Lauterbach
• Leadcore Technology
• LG Electronics
• LifeSignals
• MediaTek
• Microchip
• Microsoft
• Mimi Hearing Technologies
• MMS
• MooreElite
• Morningcore Technology
• MosChip
• MulticoreWare Inc.
• Nations
• Nextchip
• Nokia
• Nordic
• Novatek
• Nurlink
• nViso
• NXP
• O-Ran
• ON Semiconductor
• Optek
• Oticon
• P-Product
• PA
• PathPartner
• Picocom
• PiSofttech
• ProteanTecs
• Quadros Systems
• Ramon Space
• RDA Microelectronics
• Renesas Electronics
• RISC-V
• Rockchip
• ROHM
• RT-Thread
• Rubidium
• Samsung
• Samsung
• SaneChips
• SatixFy
• SemiWiki
• Sensory
• Sequans
• Shanghai Frequen
• Shanghai InfoTM Microelectronics
• Sharp
• SiFive
• SiFlower
• SigmaStar
• SIRIUS WIRELESS PTE. LTD.
• SMIC
• SMIC
• Socionext
• Solomon Systech
• Sonova
• Sony
• SRT Group
• STMicroelectronics
• STMicroelectronics
• Sunplus mMedia
• TandemG
• Texas Instruments
• ThreadX
• THX
• Toshiba
• Tower
• TSMC
• TurboConcept
• UltraSoC
• UMC
• Unisoc
• Veriest
• Visidon
• VISIONARY.ai
• Vocal
• VWorks
• Waves
• Wi-Fi Alliance®
• Winner Micro
• Xincomm
• Yamaha
• ZTE Corporation

News

• ‘The AI Inference Processor is Dead’
• 2018 embedded processor report: Rise of the neural network accelerator
• 5G Aim at LEO Satellites Will Stimulate Growth and Competition
• A Bundle of Goodies in Bluetooth 5.2, LE Audio
• Active Voice
• Add UWB hardware and software to IC designs
• AI at the Edge No Longer Means Dumbed-Down AI
• AI Processors Dive Into Deep Learning At The Edge
• All-In-One Edge Surveillance Gains Traction
• An AI assist for 5G enhanced Mobile Broadband for mobile platforms
• An Easy Path to Bluetooth 5-enabled SoC Design
• Arm & CEVA ship record chips, SOMs, and more
• Artificial Intelligence (AI): Who, What, When, Where, Why?
• Artificial Intelligence and Deep Learning at the Edge
• Artificial Intelligence in Cars — Inside the Brains
• Automakers Sharing Data? When Cars Fly
• Autonomous Driving, Let’s Be Realistic!
• Autotalks and CEVA collaborate on world’s first global V2X solution
• Awards Celebrating Innovation and Achievement in Computer Vision and Edge AI 2022
• Baseband modem IP supports handsets, IoT, FWA with less power
• Benchmark: Ceva one of main beneficiaries from iPhone 7
• Bluetooth Based Positioning, More Accurate, More Reliable, Safer
• Bluetooth SIG Promotes First Ever Auracast Experience at MWC 2023 in Barcelona
• Bluetooth, Seeing IoT Growth, Seeks to Build on a Successful Standard
• boAt to unveil and showcase the best of their 2023 line-up at CES
• Bringing AI to the farthest edge requires new computing
• Can we trust the cloud for video analytics?
• CEO Panush Writes Ceva’s Next Growth Chapter
• CES 2024: Automotive software, AI, and autonomous aerial robots
• CEVA Accelerates 5G Infrastructure Rollout with Industry’s First Baseband Platform IP for 5G RAN ASICs
• CEVA acquires Hillcrest Labs from InterDigital
• CEVA acquires Hillcrest Labs intelligent sensor technologies
• CEVA acquires Hillcrest Labs intelligent sensor technologies business
• Ceva acquires smart sensing co Hillcrest Labs
• CEVA Adds Heterogenous AI Acceleration to Third-Gen Engine
• Ceva and Arm Forge Alliance to Revolutionize 5G SoC Development for Infrastructure
• CEVA and ASR Microelectronics Achieves Milestone with Shipment of 100 million Wireless IoT Chips
• CEVA Announced the Most Powerful DSP Architecture
• CEVA Announces NeuPro-S Second-Generation NN IP
• CEVA Announces PentaG 5G NR Modem IP Platform
• CEVA Announces SensPro – New High Performance Sensor Hub IP
• Ceva Brings AI to 5G
• CEVA ClearVox Simplifies Voice Pickup
• CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware IoT Devices
• CEVA Fortrix™ SecureD2D IP: Securing Communications between Heterogeneous Chiplets
• Ceva goes non-DSP with neural processor
• CEVA improves cellular IoT core
• Ceva in $33m move to full custom chip design
• CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices
• CEVA Introduces ClearVox Solution for Enhanced Speech Intelligibility in Voice-Enabled Devices
• CEVA Introduces ClearVox, Partners with Silentium
• Ceva Introduces Highly Accurate and Reliable RivieraWaves UWB Wireless Solutions for Consumer and Smart Home
• CEVA introduces new configurable sensor hub DSP architecture
• CEVA introduces Voice User Interface Solution for TI SimpleLink MCUs
• CEVA invests $10 million in image processing IP
• CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs
• CEVA Launches Fifth-Generation Machine Learning Image and Vision DSP Solution: CEVA-XM6
• Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
• Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
• CEVA PentaG2 5G NR IP Platform
• CEVA Presents its XM6 Embedded Vision Platform
• CEVA refines its Vision DSP by Peter McGuinness
• CEVA Refresh its Business Model: Acquires Sensor Business of Hillcrest
• Ceva releases Dragonfly NB2 for internet of things
• CEVA Sextuples Speed of SensPro Smart Devices Sensor Hub
• CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio
• CEVA support sparsity, transformers in IP core for generative AI
• CEVA to acquire chip design specialist
• Ceva Unveils Hybrid DSP/Controller
• CEVA Ups the Ante for Edge-Based AI
• Ceva Uses Machine Learning to Bolster Wireless Modems
• CEVA WhisPro is a Low Power Wake Word Detection Solution at the IoT Chip Level
• CEVA-BX: A Hybrid DSP and Controller
• CEVA-Dragonfly NB2 Targets Next-Gen Narrowband IoT
• CEVA’s 5G IP modem reveals New Industrial Mega-trends
• CEVA’s BLE 5.2 Platform Garners Bluetooth SIG Qualification
• CEVA’s LE Audio/Auracast Solution
• CEVA’s NB-IoT IP Completes Protocol Conformance Testing using R&S Communication Tester
• CEVA’s NeuPro Chips Promise Up To 12.5 TOPS Embedded AI Performance
• CEVA’s PentaG2 IP Aims to Streamline 5G NR Modem Design
• Challenges and Emerging Applications for Deep Learning/AI
• China Mobile, Huawei’s top customer, seeks open RAN diversity
• Chip giants pelt embedded AI platforms with wads of cash
• Combo Wireless. I Want it All, I Want it Now
• Communication Processors March on But 5G Demands Much More
• Compute at the Edge
• Configurable IoT processor handles it all
• Dead reckoning software solution for indoor autonomous robots
• Deep Learning Challenges in Embedded Platforms
• Deep Learning To Be In Smartphones Soon, Say CEVA, Rockchip
• Deploying Deep Learning/AI
• Deutsche Telekom wins new partners for IoT Solution Optimizer
• Digital pen design reinvigorated with sensor module, motion control
• Distortion Correction Algorithms Adapt Video in Real-Time
• Dragonfly-NB2: You Can Have It All in Your IoT Device
• Driver monitoring and smart auto biometrics draw lawsuit, IPO millions
• DSP core processes 5G baseband data
• DSP Hub Fuses and Processes Multiple Sensor Inputs
• eNB-IoT Rel14 IP integrates DSP, RF and software for lower cost, lower power
• Enhancing ADAS performance for safe driving
• ESC Boston: You should have been there!
• Ex-Leadcore Team Crafts SoC for Xiaomi
• Fitting GPT into Edge Devices, Why and How
• Five Minutes With…Jeff VanWashenova, Director, CEVA
• Game of Thrones: IoT Connectivity Edition. Houses LoRa Sigfox NB-IoT Wi-Fi Battle for the Kingdom
• Glasses and Open Architecture for Computer Vision
• How AI Changes the Future of Edge Computing
• How hardware emulation helps drones take flight
• Hybrid DSP From CEVA Adds Controller Functionality
• Imagination fades in 2016 semiconductor IP market
• Inference at the edge
• Intelligent Vision in (almost) Every Application
• Is C-V2X Overtaking DSRC in Vehicle-to-Vehicle Communications?
• Learning how to learn: Toddlers vs. neural networks
• LIDAR-based SLAM, What’s New in Autonomous Navigation
• Living on the edge with AI
• Low power FiRa 2.0 IP to drive UWB into industrial, consumer
• Low Power Positioning for Logistics – Ultimate Tracking
• Low-Power UWB IP Meets Needs of IoT, Consumer Apps
• Mobile Processors of 2018: The Rise of Machine Learning Features
• MosChip’s strategic initiatives in India’s rising semiconductor market: acquisitions, collaborations, and innovations
• Multi-function DSPs Keep Wearable Devices Ticking
• Narrow-Band IoT Adoption Grows as IP Options Narrow
• Navigating Edge AI Architectures: Power Efficiency, Performance, and Future-Proofing
• Navigating the Way to Autonomous Vehicles: Who’s in the Driver’s Seat?
• Neural processor IP tackles generative AI workloads
• New Capabilities and a Growing Ecosystem
• New DSP IP Makes Your Eyes Water
• Nextchip Demonstration of Efficient Driver Monitoring for Automotive Cameras
• Nextchip SoC Teams Up with CEVA Platform to Boost Real-Time Image Processing for ADAS
• OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023
• Processors for AI applications
• Protocols For The Wide-Area IoT
• Push-Button Generation of Deep Neural Networks
• Racing to Offer Mobileye ‘Killer Chip’
• RedCap Will Accelerate 5G for IoT
• Riviera Waves dual mode platform gets Bluetooth SIG qualification
• Rockchip Licenses CEVA’s Vision Processor IP For Deep Learning
• Sanechips licenses CEVA IoT processor
• SatixFy to Deliver Advanced Modems for 288 Landing Station Antennas across the Global Telesat Lightspeed Terrestrial Network
• Semiconductor IP on Fortune’s 2017 100 Fastest-Growing Companies List!
• Semiconductor Sphere: Why is SoC Gaining Momentum in IoT Innovation?
• Sensor Fusion Brings Earbuds into the Modern Age
• Sensor Fusion in Hearables. A powerful complement
• Sequans licenses CEVA 5G modem IP for IoT platform
• Seventh Sense Blog Artificial Intelligence in Autonomous Driving
• Seventh Sense Blog Choosing The Best Vision System For Highly Automated Vehicles
• SiFive and Ceva Partner To Build Mainstream Edge AI Processors
• SLAM SDK targets mobile, AR/VR and autonomous mobility
• The CEVA-XC12 targets the extreme DSP demands of 5G
• The end of the smartphone era: What will be the technology battlegrounds of the next decade?
• The Foundation for Taking IoT Devices Everywhere
• The Future of Smartphone Photography: Dual Cameras Meet Machine Learning
• The Future of the Camera: Who Wins, Who Loses
• The Robots are Coming!
• The Week In Review: Design
• Top 10 5G chips and modules
• Ubiscale announces new customer for Cobalt, its low-power GNSS IP core
• UWB Spreads Its Wings for Secure Keyless Access
• UWB Tech Takes Automotive and Tracking Applications by Storm
• Veriest Solutions and CEVA Collaborate for Neural Network Signal Processing IP Project
• Vision and neural nets drive demand for more powerful chips
• Vision is the next big challenge for chips
• Voice and AI Explosion Rocks CES
• Wacom announce tech collaboration for next gen digital pen
• Week In Review: Design, Low Power
• Week In Review: IoT, Security, Autos
• What’s Powering Performance and Efficiency in the Latest Wi-Fi Standards?
• WhisPro: A Speech Recognition Option from CEVA
• Why your device and your charger should talk over BLE
• Wi-Fi 6E will rapidly deliver benefits in 6 GHz once available
• Wi-Fi Alliance® introduces Wi-Fi 6
• Wi-Fi Bulks Up
• Wireless Audio and Bluetooth LE Audio – Assistance, Hearables, and Headphones 3.0
• Year in Review: CPU-IP Vendors Chase High-End Wins

Press Releases

• 3COM Licences Parthus Technology for Use in Mobile Product Line
• 3COM makes Equity Investment in Parthus Technologies
• About The Industrial Technology Research Institute
• Actions Semiconductor Licenses CEVA-TeakLite-4 Audio DSP and CEVA-Bluetooth IP
• Advanced Bionics Deploys CEVA-TeakLite DSP Core to Enhance Its Harmony HiResolution Bionic Ear System
• Agilent signs Portfolio License Agreement with Parthus for range of Industry-Leading Mobile Internet Platforms
• AIC Semiconductor Licenses CEVA’s 802.11ax Wi-Fi 6 IP for IoT Connectivity
• Alliantek Licenses CEVA-X DSP and Multimedia Subsystem for Multi-Standard Multimedia Platform
• Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices
• AM3D and CEVA Partner to Provide Innovative Sound Enhancement Technology for Portable Devices
• Ambiq Micro’s Next-Generation Subthreshold Power-Optimized Technology (SPOT) Platform Features CEVA’s Bluetooth Low Energy IP
• Aralion Licenses Parthus’ Industry-Leading Bluetooth™ Platform to Power Next Generation Mobile Internet Chipsets
• ArcSoft and CEVA Partner to Raise the Performance Level of Smartphone Cameras
• ARM Collaborates with DSP IP Leaders on DSP Integration Specification
• ARM PrimeXsys Community Program Expands Further With Addition of DSP IP Vendors New members add integrated DSP functionality to PrimeXsys Platforms
• ArrayComm and CEVA Demonstrate TD-LTE Base Station
• ArrayComm and CEVA Partner to Develop LTE Wireless Infrastructure Solution
• Art's Leading Recognition Technologies Ported To Parthus' Mobile Computing Platform
• Artosyn License and Deploy CEVA-XM4 Intelligent Vision Platform for Embedded AI SoC
• ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems
• ASR License CEVA DSP and Connectivity Technologies for Smartphones and IoT Devices
• Atmel Licenses Industry-Leading CEVA-X DSP And System Platform To Power Next-Generation High Performance Storage Applications
• Autotalks and CEVA Collaborate on World’s First Global V2X Solution
• Autotalks License and Deploy CEVA DSP for Mass-Market V2X Chipset
• Beceem Selects CEVA-XC DSP for 4G Multi-Mode Baseband Chipsets
• Beken Adopts CEVA DSP and Connectivity IPs for its Wireless Audio SoC Roadmap
• Beken License CEVA Bluetooth 2.1+EDR and 4.0 IP for Low Power Bluetooth Product Families
• Bestechnic Licenses CEVA Bluetooth® 5 Dual Mode IP for its Audio Platforms
• Bragi and CEVA Collaborate to Redefine Hearable Devices
• Brillian Partners With CEVA To Develop Microdisplay Driver Chipset Solution For High-Definition Televisions
• Brite Semiconductor, CEVA and SMIC collaborate on IoT ASIC platform
• Broadcom Utilizes CEVA DSP Core To Power Edge Cellular Solution
• BroadLight Selects CEVA VoIP Platform for GPON Residential Gateway SoC
• Cadence and CEVA Collaborate to Deliver Verification Process Automation to End Customers
• Cadence to Acquire Intrinsix Corporation from CEVA
• Catena Partners with CEVA for Complete Wi-Fi and Bluetooth Solutions for Mobile, Wearable and IoT Devices
• Celeno Adopts CEVA DSP for High Performance 802.11ac Wave 2 4×4 Products
• Cellular3G Integrates CEVA-X DSP Core Into UMTS Baseband Chip for 3G Mobile Phone Applications
• Ceragon License CEVA DSPs for Full 5G Wireless Backhaul
• CEVA Accelerates 5G Infrastructure Rollout with Industry’s First Baseband Platform IP for 5G RAN ASICs
• CEVA Accelerates Machine-to-Machine System Design with Communication Reference Platform
• CEVA Acquires Hillcrest Labs Intelligent Sensor Technologies Business from InterDigital
• CEVA Acquires RivieraWaves, Expands IP Offering with Connectivity for Smartphones, Tablets, Small Cells and the Internet of Things
• CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application Software Portfolio for Embedded Systems targeting Hearables and other Consumer IoT Markets
• CEVA Addresses the Next Trends in Mobile, Digital Home and Automotive at CES 2014 with Range of Platform IP Solutions for SoC Design
• CEVA Adds ONNX Support to CDNN Neural Network Compiler
• Ceva and Actions Technology Commemorate Landmark Achievement, Surpassing 100 Million Ceva-Powered Wireless Audio and AIoT Processors Shipped
• CEVA and AdasWorks to Demonstrate Free Space Detection for Autonomous Driving at AutoSens Conference 2016
• CEVA and Alango Partner to Add Innovative Voice Enhancement Software to CEVA-TeakLite-III DSP family
• CEVA and Antcor Announce Low Power, Wi-Fi 802.11ac Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework
• CEVA and Aricent to Demonstrate LTE PHY Platform for Cellular Handsets at LTE World Summit 2009
• CEVA and ARM Partner to Enhance Development Support of CEVA DSP + ARM Multiprocessor SoCs
• CEVA and Arteris Partner on Multi-Core Interconnect for Next-Generation SoC Designs
• CEVA and ASR Micro Celebrate Milestone – 100 Million Wireless IoT Chips Shipped
• CEVA and ASTRI Form Partnership to Develop New-Generation Multimedia Solutions for Hong Kong and Greater China
• CEVA and ASTRI Unveil Dragonfly NB1, a Licensable NB-IoT Solution For Cost and Power-Sensitive LTE IoT Devices
• CEVA and Autotalks Expand Collaboration to Create World’s First 5G-V2X Solution
• CEVA and Brodmann17 Partner to Deliver 20 Times more AI Performance for Edge Devices
• CEVA and Carbon Design Systems Partner to Offer Fast Simulation Models for CEVA DSPs
• CEVA and CellGuide Partner to Offer Software GPS Solution on CEVA-XC
• CEVA and Comsys Partner for Development of Multimode WiMAX Processors
• CEVA and Comsys to Demonstrate Comprehensive EDGE/GPRS/GSM Solution for Cellular Handsets at 3GSM World Congress 2005
• CEVA and CoWare Announce Availability of Processor Support Packages for CEVA Cores Within CoWare ESL Design Environment
• CEVA and Cyberon Partner for Ultra-low Power Always-listening Voice Activation Solution
• CEVA and DARPA Establish Partnership for Technology Innovation
• CEVA and eyeSight Announce Availability of Software-based Gesture Recognition Solution for the CEVA-MM3101 Imaging and Vision Platform
• CEVA and Gennum’s Snowbush IP Group Partner to Deliver Complete SAS 2.0 IP Solution for Embedded Storage Applications
• CEVA and HuaXun Partner to Deliver Software GPS Solution for CEVA-X DSP Cores and MM2000 Multimedia Platform
• CEVA and Idea! Electronic Systems Partner to Deliver Software-Based ISDB-T Solution for DTV Demodulation
• CEVA and Ignios Demonstrate Multicore DSP
• CEVA and Immervision Enter into Strategic Partnership for Advanced Image Enhancement Technologies
• Ceva and India’s No. 1 Audio and Wearable Brand, boAt, Announce Strategic Partnership to Enhance the Wireless Audio Experience
• CEVA and LG Electronics Partner for Smart 3D Camera Solution
• CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances
• CEVA and Mimi Hearing Technologies Partner to Democratize Assistive Hearing for the True Wireless Earbuds Market
• CEVA and mimoOn Offer Complete LTE PHY Reference Architectures for UE and eNodeB Applications
• CEVA and mimoOn to Collaborate on Development of LTE Baseband Solutions
• CEVA and Mindspeed Extend Relationship to Address LTE-Advanced Small Cells
• CEVA and Mindspeed to Demonstrate Real-World LTE Small Cell Base Station Technology at 4G World
• CEVA and mPerpetuo Partner to Deliver Halide Support for CEVA Vision Processors
• CEVA and NBICC Collaborate to Add China’s AVS Video Standard to Portfolio of Audio/Video Codecs for CEVA’s MM2000 Platform
• CEVA and NextG-Com Partner to offer Integrated LTE Cat-M1 and Cat-NB1 Solutions for Cost-Sensitive IoT applications
• CEVA and Nokia Collaborate for 4.9G and 5G Technologies
• CEVA and nViso Partner to Bring 3D Facial Imaging and Advanced Emotion Recognition Technology to Mobile Devices
• CEVA and Orca Partner to Deliver Complete Bluetooth 4.0 Reference Design for Integration into Mobile Computing, Consumer Electronics Devices
• CEVA and Phi Algorithm Solutions to Host Webinar on Deep Learning in Low Power Embedded Systems
• CEVA and proteanTecs Announce Partnership to Optimize Reliability and Power of Complex SoCs
• CEVA and ROHM Partner for Bluetooth 2.0+EDR Reference Design Platform
• CEVA and Sensory Enable Power-Optimized Always-Listening Smart Wearables and Sensor Fusion Solutions
• CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform
• CEVA and Silentium Partner to Deliver Active Noise Cancellation Solution for the CEVA-TeakLite DSP Family
• CEVA and Spreadtrum Expand Long-Term Partnership for LTE SoCs Targeting Mid and High End Smartphones
• Ceva and THX Ltd. Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products
• CEVA and UltraSoC Partner to Enable Advanced Debug for CEVA DSP Cores
• CEVA and Visidon Partner to Bring Ultra-low Power Always-on Face Activation Technology to Mobile Devices
• CEVA and VisiSonics Bring 3D Spatial Audio to True Wireless Earbuds and Headphones for the Ultimate Hearing Experience
• CEVA and VWorks Announce Availability of Virtual Prototyping Platforms featuring CEVA DSPs
• CEVA Announces Availability of CEVA-MM3101, a Programmable, Low Power Imaging and Vision Platform for Camera-Enabled Devices
• CEVA Announces Availability of Dolby HD Audio Codec Suite for the CEVA-TeakLite-III DSP
• CEVA Announces Availability of Dolby Mobile Technology for CEVA-TeakLite-III DSP
• CEVA Announces Availability of Enhanced Voice Services (EVS) Codec for its Low Power Audio/Voice DSPs
• CEVA Announces Availability of Silicon-Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems
• CEVA Announces Availability of SLAM Software Development Kit for CEVA-XM Intelligent vision DSPs and NeuPro AI Processors
• CEVA Announces Availability of TD-SCDMA Software IP for its CEVA-XC DSP Family
• CEVA Announces Certification of RivieraWaves Surf Wi-Fi® 802.11ac IP Platform
• CEVA Announces CEVA-BX, a New All-Purpose Hybrid DSP / Controller Architecture for Digital Signal Processing and Digital Signal Control in IoT devices
• CEVA Announces DSP and Voice Neural Networks Integration with TensorFlow Lite for Microcontrollers
• CEVA Announces First Available Silicon of Mobile-Media2000 Solution for High-End Mobile Multimedia Applications
• CEVA Announces First Quarter 2004 Financial Results
• CEVA Announces Foundry Program Partnership With Tower Semiconductor
• CEVA Announces Industry’s First 802.11ax Wi-Fi IPs
• CEVA Announces Industry’s First High Performance Sensor Hub DSP Architecture
• CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond
• CEVA Announces Launch And Licensing Of Pioneering CEVA-X DSP Architecture
• CEVA Announces Launch and Licensing of Xpert-Blue Bluetooth Communications IP
• CEVA Announces Launch Of Lowest-Power SGMII IP For Gigabit Ethernet Interfaces In Enterprise And Carrier Data Communications Systems
• CEVA Announces Licensing Agreement With PMC-Sierra for Voice-Over-IP Platform to Enable VoIP in Fiber-to-the-Home SoC Solutions
• CEVA Announces Live Webinar for December 1: Trends and Challenges: Designing a 4G Multi-mode Wireless Baseband for Infrastructure Applications – From Femtocells to Macrocells
• CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped
• CEVA Announces New Application Developer Kit for CEVA-MM3000 Imaging & Vision Platforms
• CEVA Announces Next Generation CEVA-TeakLite-III DSP Architecture Featuring Native 32-Bit Processing
• CEVA Announces Record Fourth Quarter Revenue and Earnings
• CEVA Announces Record Revenues for the Fourth Quarter, Schedules Fourth Quarter and Year End 2016 Earnings Release and Conference Call
• CEVA Announces Reorganization And Management Changes
• CEVA Announces Second Quarter 2004 Financial Results
• CEVA Announces Silicon-based Platform to Streamline Development of Low-Power ‘Smart and Connected’ Devices
• CEVA Announces Strengthening of Board of Directors and Appointments to Newly Formed Executive Advisory Board
• CEVA Announces the Certification of RivieraWaves Bluetooth Smart 4.2 Platform IP
• CEVA Announces Third Quarter Results – A Record 30 Million Units Shipped In The Third Quarter Reflects Strong End Markets Growth
• CEVA Announces Time Change to Fourth Quarter and Year End 2005 Conference Call and Webcast
• CEVA Appoints Bernadette Andrietti to its Board of Directors
• CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires
• CEVA Appoints Maria Marced, President of TSMC Europe, to Board of Directors
• CEVA at CES 2015: Powering the Next Wave of Intelligent Connected Devices
• CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry’s Leading Portfolio of Communications, Multimedia and Connectivity IPs
• CEVA Audio Front End Software Solution Becomes Alexa Voice Service (AVS) Qualified
• CEVA Bluebud™ Platform Takes Center Stage for a Differentiated, Premium Wireless Audio Experience in TWS Earbuds, Gaming Headsets, Hearables, Wearables and More
• CEVA Bluetooth® 5.3 Platform IP Supports New Auracast™ Broadcast Audio, Transforming the Shared Audio Experience
• CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market
• CEVA Brings a High Performance, Low-Power Audio Platform to Consumer Devices
• CEVA Brings Human-Like Intelligent Vision Processing to Low-Power Embedded Systems
• CEVA Brings its Leading-Edge Solutions for Smarter, Connected Devices to CES
• CEVA Celebrates 10 Billion CEVA-powered Devices Shipped by Ringing the Nasdaq Opening Bell
• CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped
• CEVA Celebrates Wireless IoT Milestone, Surpassing 100 Licensing Deals for its Bluetooth and Wi-Fi Technologies
• CEVA Collaborate for Future Wireless Baseband Technologies with NEC CASIO Mobile Communications
• CEVA Collaborates with Ellisys to Achieve SIG Qualification for its Bluetooth® 5.1 Low Energy IP
• CEVA Collaborates with Tessera to Demonstrate Embedded Image Enhancement Technologies on MM2000 Portable Multimedia Platform
• CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab
• CEVA Computer Vision DSP Powers Evomotion ROD-1 360° Video Camera
• CEVA Computer Vision, Deep Learning and Long Range Communication Technologies Power DJI Drones
• CEVA Confirmed As World’s Leading Licensor Of DSP Intellectual Property
• CEVA Continues to Dominate DSP IP Market with 90% Market Share
• CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth® 5.3 IP
• CEVA Debuts CEVA-X1641 – High-Performance Quad-MAC DSP Targeting Next-Generation Cellular and Portable Multimedia Applications
• CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware IoT Devices
• CEVA Deep Neural Network Software Framework Named “2017 Most Innovative Product” by Embedded Computing Design
• CEVA Demonstrates Interoperability of Breakthrough Sub 80mW Serial ATA IP Solution
• CEVA Demonstrates Significant Asia-Pac Momentum With New Customer Wins At Top Asia Pacific Companies
• CEVA Dominates DSP Licensing Market with 78% Market Share
• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
• CEVA DSP Powers Samsung’s First Generation LTE Modem
• CEVA DSPs Continue to Lead the Way at Mobile World Congress
• CEVA DSPs Cores and Embedded Technologies Power Leading Consumer Electronics Products at CES 2009
• CEVA Enhances its CEVA-XC DSP Product Offering With HSPA+ Software IP
• CEVA Enhances the User Experience and Extends the Use Cases for TWS Earbuds and Hearables with New MotionEngine™ Hear Sensor Fusion Software
• CEVA Enriches its Computer Vision Software Library for Flagship CEVA-MM3101 Imaging and Vision Platform
• Ceva Expands AI Ecosystem for its Class-Leading NPU IP with New Partnerships for Automotive and Edge AI
• CEVA Expands CEVA-X DSP Family With New Core and System Platform
• CEVA Expands Global Presence With New Sales and Support Office in Shanghai, China
• CEVA Expands Into 4G Wireless Infrastructure Market With Industry-First Vector DSP for Software Defined Radio Platforms
• CEVA Expands Its Market-Leading Wireless Connectivity Portfolio with New Ultra-Wideband Platform IP
• CEVA Expands its Multimedia Platform Offering with Addition of RealVideo and VC-1 Video Standards
• CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection
• CEVA Expands Storage Interface Offering With Comprehensive Serial Attached SCSI (SAS) IP Solution
• CEVA Extends Bluetooth Portfolio With Bluetooth 4.0 IP
• CEVA Extends Connectivity Product Line With Bluetooth 2.0+EDR
• CEVA Extends its CDMA Market Reach With VIA Telecom’s Latest Design Wins
• Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT
• CEVA Extends its IP Platforms for Bluetooth and Wi-Fi with RISC-V
• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
• CEVA Extends its Leadership in NB-IoT IP with CEVA-Dragonfly NB2, the World’s First eNB-IoT Rel14 Solution
• CEVA Extends its RivieraWaves UWB IP to Support CCC’s Digital Key 3.0 Standard for Keyless Access to Vehicles
• CEVA Extends SATA/SAS Portfolio With 12Gbps SAS-3 IP
• CEVA Extends Wi-Fi Portfolio with Wi-Fi 6/6E IP for the Access Point Market
• CEVA Extends Worldwide Leadership in DSP Licensing
• CEVA First to Deliver Bluetooth® 5 Dual Mode IP
• CEVA Inc. Reports Second Quarter 2005 Financial Results
• CEVA Inc. Reports Second Quarter 2006 Financial Results
• CEVA Inc. Reports Third Quarter 2006 Financial Results
• CEVA Increases Commitment to Taiwan Market With Increased Local Presence
• CEVA Introduces AMF™ – Android Multimedia Framework for Energy Efficient Multi-Core Systems
• CEVA Introduces CEVA-TeakLite-4 — The Most Powerful, Low Power 32-bit DSP Architecture Framework for Advanced Audio and Voice Applications
• CEVA Introduces Channel Sounding over Bluetooth® to Enable High-Accuracy Secure Positioning for Automotive, Industrial and the IoT Ecosystem
• CEVA Introduces ClearVox™- Advanced Software Package Providing Enhanced Speech Intelligibility for Voice-Enabled Devices
• CEVA Introduces Comprehensive Computer Vision Library Optimized for CEVA-MM3101 Imaging & Vision Platform
• CEVA Introduces Comprehensive Partner Program Accelerating the Development of LTE, WiMAX and SDR Wireless Communications Solutions
• CEVA Introduces Deep Neural Network Framework to Accelerate Machine Learning Deployment in Low-Power Embedded Systems
• CEVA Introduces Digital Video Stabilizer Software Module for CEVA-MM3000 Targeting Next Generation Smartphones and Mobile Devices
• CEVA Introduces Fully Integrated Ultra-Low Power Voice Over IP (VoIP) Platform for Dual Mode VoIP/Cellular Phone Applications and Residential Gateways
• CEVA Introduces Fully-Integrated Wi-Fi Solution to Connect IoT Devices to the Alibaba Cloud
• CEVA Introduces Industry’s Most Compact and Power-Efficient Single-Core DSP Solution for HD Audio Applications
• Ceva Introduces its Next Generation Low Power Ultra-Wideband IP for FiRa 2.0 to Provide Highly Accurate and Reliable Wireless Ranging Capabilities for Consumer and Industrial IoT Applications
• CEVA Introduces Lightweight Multi-Purpose Processor for the Massive Internet of Things
• CEVA Introduces Low Power, Multi-Mode LTE-Advanced Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework
• CEVA Introduces MUST™ Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework
• CEVA Introduces New AI Inference Processor Architecture for Edge Devices with Co-processing Support for Custom Neural Network Engines
• CEVA Introduces New Low Power Communication DSPs to Address the Multimode Connectivity Requirements of IoT and M2M
• CEVA Introduces PentaG™ – A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices
• CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
• CEVA Introduces the CEVA-XC4500, the World’s First Vector Floating-Point DSP for Wireless Infrastructure Solutions
• CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity
• CEVA Introduces UWB Radar Platform for Automotive Child Presence Detection to Meet Emerging Safety Specifications
• CEVA Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs
• CEVA Introduces WhisPro™, Neural Network-Based Speech Recognition Technology For Voice Assistants and IoT devices
• CEVA Introduces World’s First Software-Based Super-Resolution Technology for Low Energy Mobile Applications
• Ceva Joins Arm Total Design to Accelerate Development of End-to-End 5G SoCs for Infrastructure and NTN Satellites
• CEVA Joins Heterogeneous System Architecture (HSA) Foundation, Contributing World-Class DSP Technologies for Imaging and Vision Enabled Embedded Platforms
• CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs
• CEVA Joins Intel Pathfinder for RISC-V Program
• CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets
• CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine™ Software
• CEVA Launches CEVA-X System On Chip Platforms For Wireless, Consumer And Multimedia Markets
• CEVA Launches CEVAnet Partner Program To Extend DSP Offerings And Deliver Complete Solutions
• CEVA Launches Foundry Program With UMC
• CEVA Launches Mobile-Media – The First Fully Programmable Solution For Mobile-Multimedia Applications
• Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
• Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
• CEVA Launches New System-on-Chip (SoC) Family Member: CEVA Xpert-Palm
• CEVA Launches Xpert-Media – A Complete, Licensable and Scalable Video and Audio Media Processing Platform
• CEVA Leads Israeli Smart Grid Consortium for the Advancement of Smart Grid Technologies
• CEVA Leads the Bluetooth® 5 IP Wave
• CEVA Leads the Way at Mobile World Congress 2008 With Industry Leading Portfolio of Mobile Intellectual Property
• CEVA Licenses CEVA-X DSP Architecture to Korea’s EoNex to Power 3G Wireless Solutions
• CEVA licenses Flagship DSP to Renesas Electronics for Next-Generation Intelligent Transport Systems
• CEVA Licenses Xpert-Teak DSP Platform To National Semiconductor
• CEVA Licenses Xpert-Teak DSP Platform To Sharp For Portable Multimedia Devices
• CEVA Locates More Success with Bluetooth® 5.1 IP
• CEVA Low Power DSP Core Enables EoNex Modem Chip, Korea’s First for CDMA2000 1x Wireless Phones
• CEVA MM2000 Multimedia Solution Powers Panovasic’s Apollo Family of Portable Multimedia Processors
• CEVA MM2000 Multimedia Solution Powers Solomon Systech MagusCore High Performance Portable Multimedia Processor
• CEVA Moves to Standardize DSP-enabled Bluetooth® Audio IP with New Bluebud™ Wireless Audio Platform for TWS Earbuds, Smartwatches and Wearables
• CEVA Named on the FORTUNE 2017 “100 Fastest-Growing Companies®” List
• CEVA NB-IoT IP Achieves Monumental Milestone; Awarded Full Certification from Deutsche Telekom
• CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz
• CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022
• CEVA Opens New Research and Development Center in Bristol, U.K.
• CEVA Partners with eyeSight to Offer Hand Gesture Recognition Solution on CEVA Multimedia Platform for Portable Devices
• CEVA Partners with Fluent.ai to Offer Multilingual Speech Understanding Solutions for Intelligent Edge Devices
• CEVA Partners with Galileo Satellite Navigation to Offer Low Power, Software-based GNSS Solutions
• CEVA Partners with Infineon Technologies for Next-Generation Wireless Platforms
• CEVA Partners with iOnRoad to Deliver Personal Driving Assistance Technology with CEVA-MM3101 Platform
• CEVA Partners with SMIC to Deliver Fully Functional Silicon for CEVA-TeakLite-III DSP Core
• CEVA Partners With TES Electronic Solutions to Bring Graphics Capabilities to MM2000 Portable Multimedia Solution
• CEVA Powers DSP Group's Next-Generation Ultra-Low-Power Always-On Voice Processor
• CEVA Puts Intuitive Motion Control in the Palm of Your Hand with New Sensor Fusion Solution for Consumer Handheld Devices
• CEVA Reaches Major Shipment Milestone, Surpassing 4 Billion CEVA-powered Chips
• CEVA Reaches New Milestone with 10th Design Win for its SIG Qualified Bluetooth® Mesh IP
• CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture
• CEVA Releases Architecture Enhancements for the CEVA-TeakLite-4 DSP Aimed at Further Improving Power Efficiency and Performance
• CEVA Releases ISO 26262 Compliant Safety Design Package for ADAS Vision Processor
• CEVA Releases SATA3.0 IP for 6Gbps SSD Applications
• CEVA Reports Record Unit Shipments of CEVA-Powered Chipsets in 2006
• CEVA Reports Solid First Quarter 2005 Financial Results
• CEVA SATA IP Deployed in Freescale’s PowerQUICC II Pro Communications Product Line
• CEVA Schedules First Quarter 2005 Earnings Release and Conference Call
• CEVA Schedules First Quarter 2006 Earnings Release and Conference Call
• CEVA Schedules First Quarter 2007 Earnings Release and Conference Call
• CEVA Schedules First Quarter 2009 Earnings Release and Conference Call
• CEVA Schedules Fourth Quarter and Full Year 2017 Earnings Release and Conference Call
• CEVA Schedules Fourth Quarter and Year End 2005 Earnings Release and Conference Call
• CEVA Schedules Fourth Quarter and Year End 2006 Earnings Release and Conference Call
• CEVA Schedules Fourth Quarter and Year End 2007 Earnings Release and Conference Call
• CEVA Schedules Fourth Quarter and Year End 2008 Earnings Release and Conference Call
• CEVA Schedules Fourth Quarter and Year End Earnings Release and Conference Call
• CEVA Schedules Second Quarter 2005 Earnings Release and Conference Call
• CEVA Schedules Second Quarter 2006 Earnings Release and Conference Call
• CEVA Schedules Second Quarter 2007 Earnings Release and Conference Call
• CEVA Schedules Third Quarter 2005 Earnings Release and Conference Call
• CEVA Schedules Third Quarter 2005 Earnings Release and Conference Call
• CEVA Schedules Third Quarter 2006 Earnings Release and Conference Call
• CEVA Schedules Third Quarter 2007 Earnings Release and Conference Call
• CEVA Schedules Third Quarter Earnings Release And Conference Call
• CEVA Selected for NXP’s Ultra Low-Cost Cellular Solutions
• CEVA SenslinQ Platform Wins 2020 ASPENCORE World Electronics Achievement Award
• CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)
• CEVA Sharpens Focus on Digital Signal Processors, Updates Q4 Guidance, and Targets Profitability in 2004
• CEVA Shatters Performance Record for Licensable DSP Core With CEVA-X
• CEVA Showcases Mobile DSP Technology Leadership at Linley Tech Mobile Conference 2012
• CEVA Speeds Customer’s Time To Silicon With The Launch Of CEVA Services
• CEVA Speeds the Development of True Wireless Stereo Earbuds with its Support of Bluetooth LE Audio
• CEVA Streamlines 5G New Radio Modem Design with PentaG2, the Industry’s Most Comprehensive 5G Baseband Platform IP for Mobile Broadband and IoT
• CEVA to Acquire Intrinsix Corp., Expanding its Offering to Include Full Turnkey IP Platforms
• CEVA to Announce Q1 Results April 20
• CEVA to Announce Second Quarter Results On July 22
• CEVA to Demonstrate Industry’s Lowest Cost-Per-Channel Voice over IP Platform at Spring VON 2006
• CEVA to Demonstrate New Multimedia and Indoor GPS Solutions for Wireless Handsets at 3GSM Asia 2005
• CEVA to Demonstrate Serial ATA PHY, Link, Transport and Command Layer Solution at Intel Developer Forum
• CEVA to Demonstrate Software-Based H.264 and GPS Technologies for Wireless Devices at 3GSM World Congress 2005
• CEVA to Demonstrate Software-Based LTE UE PHY and HD Video Platforms at CTIA Wireless 2010
• CEVA to file Form 12b-25 With the Securities and Exchange Commission
• CEVA To Host DSP and Multimedia Technology Symposium in Shanghai, China
• CEVA to Host Online Seminar Series for Wireless Connectivity and Smart Sensing Technologies
• CEVA to Participate at the 51st Annual TD Cowen Technology, Media & Telecom Conference
• CEVA To Present And Participate At GSPx – The International Embedded Solutions Event
• CEVA to Present at AeA Classic Financial Conference
• CEVA to Present at AeA Classic Financial Conference on November 8-9, 2005
• CEVA to Present at AeA Micro Cap Financial Conference on May 16, 2005
• CEVA to Present at B. Riley Investor Conference March 18 in Las Vegas
• CEVA to Present at Needham Growth Conference
• CEVA to Present at Needham’s Growth Conference
• CEVA To Present At The B. Riley & Co. Investor Conference
• CEVA to Present at the B. Riley & Co. New York Investor Conference on August 11, 2005
• CEVA to Present at the Ferris Baker Watts Video Communications and Content Conference
• CEVA To Present At The ION GNSS 2004 Conference
• CEVA to Showcase a Range of Solutions for the Future of Mobile Computing at Mobile World Congress 2014
• CEVA to Showcase Continued Leadership in Intellectual Property for Wireless Handset Applications at 3GSM World Congress 2007
• CEVA to Showcase Continued Leadership in IP for Wireless Handset Applications at 3GSM World Congress 2006
• CEVA to Showcase DSP Leadership for Advanced Wireless Communication and Multimedia Processing at CTIA Wireless 2012
• CEVA to Showcase Industry-Leading Platform IP for Communications, Vision, Imaging, Audio and Voice at Mobile World Congress 2013
• CEVA to Showcase Latest DSPs and Platform IPs for Mobile, Digital Home and Automotive at CES 2013
• CEVA to Showcase Latest IP for Digital Home and Mobile Products at CES 2012
• CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023
• CEVA to Showcase Leadership in Mobile DSP Technologies for Advanced Communication and Multimedia Applications at Mobile World Congress 2012
• CEVA to Showcase Leading DSP Cores and Integrated Solutions at 3GSM World Congress
• CEVA to Showcase Mobile Intellectual Property Leadership at Mobile World Congress 2009
• CEVA to Showcase Next-Generation 4G and Multimedia Technologies at Mobile World Congress
• CEVA to Unveil its CEVA-X2 DSP at the Linley Mobile & Wearable Conference 2016
• CEVA Unveils a New Addition to the Powerful CEVA-X DSP Family
• CEVA Unveils Bluetooth Solution for CEVA-TeakLite-4 DSP Targeting Low Power, Always-on, Smart Connected Devices
• CEVA Unveils High-Performance, Low Power Platforms for Wireless, Multimedia Applications
• CEVA Unveils Industry’s First C-Based Application Optimization Toolchain for Licensable DSPs
• CEVA Unveils Industry’s First Multipurpose Programmable HD Video and Image Processing Platform for Connected Multimedia Devices
• CEVA Unveils Industry’s Highest Performance DSP Architecture for 3.5G/4G Terminals and Infrastructure SoCs
• CEVA Unveils MotionEngine™ Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots
• CEVA Unveils NeuPro™ – A Family of AI Processors for Deep Learning at the Edge
• CEVA Unveils New Family of Multimedia Solutions for High Volume, Low Cost Mobile Consumer Electronics
• CEVA Unveils the CEVA-XC4000 – A Low-Power DSP Architecture Framework for the Widest Array of Advanced Wireless Standards
• CEVA Unveils Wi-Fi IP Platforms to Enable a Broad Range of Connected Devices
• CEVA Unveils World’s Most Powerful DSP Architecture
• CEVA Utilizes Synopsys’ Design Compiler Graphical to Achieve Higher Frequency and Smaller Area for its DSP Cores
• CEVA Welcomes the Introduction of Bluetooth® 5, the Next-Generation Bluetooth Standard
• CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC
• CEVA Wins 2018 CEM Editor’s Choice Award for its NB-IoT IP Solution
• CEVA Wins 2019 CEM Editor’s Choice Award for its Bluetooth 5 IP
• CEVA Wins CEM Editor’s Choice Award for Breakthrough CEVA-X1 IoT Processor
• CEVA Wins Electronic Products China ‘Product of the Year Award’ for CEVA-XC323 Communications Processor
• Ceva Wins Product of the Year Award at Prestigious EE Awards Asia Event
• CEVA Xpert-Teak DSP Subsystem Powers National Semiconductor’s New CP3SP33 Telematics Chip Targeting Analog-Rich Automotive Multimedia Applications
• CEVA's 2nd Generation Neural Network Software Framework Extends Support for Artificial Intelligence Including Google's TensorFlow
• CEVA's New LTE Software Library Accelerates 4G Modem Development
• CEVA’s 2018 Technology Symposium Series Coming to Taiwan, China and Japan
• CEVA’s Bluetooth 5 Low Energy Software and Link Layer IP Integrate with Atmosic Technologies Solutions for Battery-Free IOT Devices
• CEVA’s Bluetooth Low Energy IP Powers NXP QN9000 Series of Bluetooth Smart SoCs
• CEVA’s Bluetooth® 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester
• CEVA’s Bluetooth® 5 Low Energy IP Powers ON Semiconductor’s Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices
• CEVA’s Bluetooth® Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More
• CEVA’s Bluetooth® Dual Mode 5.3 SIG Qualified Platform Offers Improved Security, Less Interference and Better Power Consumption for Wireless Audio
• CEVA’s Bluetooth® Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification
• CEVA’s DSP Cores are the Preferred Choice of the World’s Leading Wireless Handset IC Suppliers and OEMs
• CEVA’s Fully Programmable Mobile Multimedia Solution Passes Allegro H.264 Test Suite
• CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC
• CEVA’s MotionEngine™ Smart TV Software Comes to More Smart TV brands via LG webOS
• CEVA’s NeuPro Family of Edge AI Processors Wins “Digital Semiconductor Product of the Year” at Elektra Awards 2018
• CEVA’s New 1 GHz Programmable DSP Core Offers Exceptional Performance and Power Efficiency for Next Generation Communications and Multimedia SoCs
• CEVA’s New DSP Core Delivers Highest Audio Performance, User Flexibility, and Broad Codec Support
• CEVA’s New LTE Software Library Accelerates 4G Modem Development
• CEVA’s Wi-Fi 6 Solution Becomes World’s First IP to Achieve Wi-Fi CERTIFIED 6™ Status from the Wi-Fi Alliance®
• CEVA’s Xpert-GPS Solution Utilizes Proven DSP Technology to Lower Cost and Improve Battery Life of Global Positioning-Enabled Mobile Devices
• CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds
• CEVA, DiMAGIC Corporation Ltd. Partner to Integrate Adaptive Beam-forming Using Microphone Array Technology with CEVA-TeakLite Family of DSPs
• CEVA, Dirac Partner to Offer Speaker Correction Audio Post-processing Technology for the CEVA-TeakLite-III Architecture
• CEVA, Inc. 2004 Annual Report and Accounts
• CEVA, Inc. Added to Russell 2000 Index
• CEVA, Inc. Adopts Rule 10b5-1 Stock Repurchase Plan
• CEVA, Inc. Adopts Rule 10b5-1 Stock Repurchase Plan
• CEVA, Inc. Announces All-Time High Revenues for the Third Quarter and Schedules Third Quarter 2015 Earnings Release and Conference Call
• CEVA, Inc. Announces August Schedule of Events with the Financial Community
• CEVA, Inc. Announces CEO Transition Plan
• CEVA, Inc. Announces Divestment of Its GPS Technology and Product Line
• CEVA, Inc. Announces Expansion of Existing Share Repurchase Program
• CEVA, Inc. Announces Expansion of Existing Stock Repurchase Program
• CEVA, Inc. Announces Expansion of Existing Stock Repurchase Program
• CEVA, Inc. Announces First Quarter 2009 Financial Results
• CEVA, Inc. Announces First Quarter 2011 Financial Results
• CEVA, Inc. Announces First Quarter 2012 Financial Results
• CEVA, Inc. Announces First Quarter 2013 Financial Results
• CEVA, Inc. Announces First Quarter 2014 Financial Results
• CEVA, Inc. Announces First Quarter 2015 Financial Results
• CEVA, Inc. Announces First Quarter 2016 Financial Results
• CEVA, Inc. Announces First Quarter 2017 Financial Results
• CEVA, Inc. Announces First Quarter 2018 Financial Results
• CEVA, Inc. Announces First Quarter 2019 Financial Results
• CEVA, Inc. Announces First Quarter 2020 Financial Results
• CEVA, Inc. Announces First Quarter 2021 Financial Results
• CEVA, Inc. Announces First Quarter 2022 Financial Results
• CEVA, Inc. Announces First Quarter 2023 Financial Results
• CEVA, Inc. Announces Fourth Quarter 2021 Financial Results
• CEVA, Inc. Announces Fourth Quarter And 2003 Year-End Results
• CEVA, Inc. Announces Fourth Quarter and 2013 Financial Results
• CEVA, Inc. Announces Fourth Quarter and 2014 Financial Results
• CEVA, Inc. Announces Fourth Quarter and 2015 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Full Year 2022 Financial Results
• Ceva, Inc. Announces Fourth Quarter and Full Year 2023 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2007 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2008 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2009 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2012 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2016 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2017 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2018 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2019 Financial Results
• CEVA, Inc. Announces Fourth Quarter and Year End 2020 Financial Results
• CEVA, Inc. Announces June Schedule of Events with the Financial Community
• CEVA, Inc. Announces March Schedule of Events with the Financial Community
• CEVA, Inc. Announces May 2008 Schedule of Events With the Financial Community
• CEVA, Inc. Announces Preliminary Third Quarter 2013 Revenues and Sets Earnings Release Date
• CEVA, Inc. Announces Record First Quarter 2008 Financial Results
• CEVA, Inc. Announces Record First Quarter 2010 Financial Results
• CEVA, Inc. Announces Record Fourth Quarter and Year End 2010 Financial Results
• CEVA, Inc. Announces Record Fourth Quarter and Year End 2011 Financial Results
• CEVA, Inc. Announces Second Quarter 2009 Financial Results
• CEVA, Inc. Announces Second Quarter 2010 Financial Results
• CEVA, Inc. Announces Second Quarter 2011 Financial Results
• CEVA, Inc. Announces Second Quarter 2012 Financial Results
• CEVA, Inc. Announces Second Quarter 2013 Financial Results
• CEVA, Inc. Announces Second Quarter 2014 Financial Results
• CEVA, Inc. Announces Second Quarter 2015 Financial Results
• CEVA, Inc. Announces Second Quarter 2016 Financial Results
• CEVA, Inc. Announces Second Quarter 2017 Financial Results
• CEVA, Inc. Announces Second Quarter 2018 Financial Results
• CEVA, Inc. Announces Second Quarter 2019 Financial Results
• CEVA, Inc. Announces Second Quarter 2020 Financial Results
• CEVA, Inc. Announces Second Quarter 2021 Financial Results
• CEVA, Inc. Announces Second Quarter 2022 Financial Results
• CEVA, Inc. Announces Second Quarter 2023 Financial Results
• CEVA, Inc. Announces Stock Repurchase Program
• CEVA, Inc. Announces Third Quarter 2009 Financial Results
• CEVA, Inc. Announces Third Quarter 2010 Financial Results
• CEVA, Inc. Announces Third Quarter 2011 Financial Results
• CEVA, Inc. Announces Third Quarter 2012 Financial Results
• CEVA, Inc. Announces Third Quarter 2013 Financial Results
• CEVA, Inc. Announces Third Quarter 2014 Financial Results
• CEVA, Inc. Announces Third Quarter 2015 Financial Results
• CEVA, Inc. Announces Third Quarter 2016 Financial Results
• CEVA, Inc. Announces Third Quarter 2017 Financial Results
• CEVA, Inc. Announces Third Quarter 2018 Financial Results
• CEVA, Inc. Announces Third Quarter 2019 Financial Results
• CEVA, Inc. Announces Third Quarter 2020 Financial Results
• CEVA, Inc. Announces Third Quarter 2021 Financial Results
• CEVA, Inc. Announces Third Quarter 2022 Financial Results
• CEVA, Inc. Announces Third Quarter 2023 Financial Results
• CEVA, Inc. Announces Upcoming Schedule of Events With the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events with the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events With the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events With the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events with the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events With the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events with the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events with the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events with the Financial Community
• CEVA, Inc. Announces Upcoming Schedule of Events with the Financial Community
• CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer
• CEVA, Inc. Appoints Ran Soffer as Vice President of Marketing and Corporate Development
• CEVA, Inc. Fourth Quarter 2003 Earnings Release And Conference Call
• CEVA, Inc. Joins Wi-Fi Alliance® to Further Advocate for a Software-based Wi-Fi® Strategy
• CEVA, Inc. Makes Strategic Equity Investment in Antcor, a Provider of Software-Based Wi-Fi IP
• CEVA, Inc. Makes Strategic Equity Investment in eyeSight Mobile Technologies, a Gesture Technology Company
• CEVA, Inc. Names Gweltaz Toquet as Chief Commercial Officer
• CEVA, Inc. Offers MIPS $90 Million for its Operating Business
• CEVA, Inc. Reports First Quarter 2006 Financial Results
• CEVA, Inc. Reports First Quarter 2007 Financial Results
• CEVA, Inc. Reports Fourth Quarter and Year End 2005 Financial Results
• CEVA, Inc. Reports Fourth Quarter and Year End 2006 Financial Results
• CEVA, Inc. Reports Inducement Grants Under NASDAQ Listing Rule 5635(c)(4)
• CEVA, Inc. Reports Inducement Grants Under NASDAQ Listing Rule 5635(c)(4)
• CEVA, Inc. Reports Second Quarter 2007 Financial Results
• CEVA, Inc. Reports Second Quarter 2008 Financial Results
• CEVA, Inc. Reports Termination of Long-Term Dublin Lease Agreements
• CEVA, Inc. Reports Third Quarter 2005 Financial Results
• CEVA, Inc. Reports Third Quarter 2007 Financial Results
• CEVA, Inc. Reports Third Quarter 2008 Financial Results
• CEVA, Inc. Schedules First Quarter 2008 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2010 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2011 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2012 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2013 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2014 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2015 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2016 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2017 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2018 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2019 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2020 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2021 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2022 Earnings Release and Conference Call
• CEVA, Inc. Schedules First Quarter 2023 Earnings Release and Conference Call
• Ceva, Inc. Schedules First Quarter 2024 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Full Year 2018 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Full Year 2019 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Full Year 2020 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Full Year 2021 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Full Year 2022 Earnings Release and Conference Call
• Ceva, Inc. Schedules Fourth Quarter and Full Year 2023 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Year End 2009 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Year End 2010 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Year End 2011 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Year End 2012 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Year End 2013 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Year End 2014 Earnings Release and Conference Call
• CEVA, Inc. Schedules Fourth Quarter and Year End 2015 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2008 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2009 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2010 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2011 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2012 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2013 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2014 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2015 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2016 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2017 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2018 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2019 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2020 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2021 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2022 Earnings Release and Conference Call
• CEVA, Inc. Schedules Second Quarter 2023 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2008 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2009 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2010 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2011 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2012 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2014 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2016 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2017 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2018 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2019 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2020 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2021 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2022 Earnings Release and Conference Call
• CEVA, Inc. Schedules Third Quarter 2023 Earnings Release and Conference Call
• CEVA, Inc. Third Quarter 2020 Earnings Release and Conference Call Scheduled for November 5
• CEVA, Inc. to be Added to Standard and Poor’s SmallCap 600 Index
• CEVA, Inc. to Divest Equity in GloNav, Inc. Following GloNav’s Acquisition By NXP Semiconductors for $110 Million
• CEVA, Inc. to Exhibit and Participate at 4G World 2009
• CEVA, Inc. to Host DSP Technology Symposiums in Shanghai and Beijing, China
• CEVA, Inc. to Host First Investor and Analyst Day
• CEVA, Inc. to Host Investor Day on December 6, 2023
• CEVA, Inc. to Participate at Upcoming Investor Events
• CEVA, Inc. to Participate in the 34th Annual ROTH Conference
• CEVA, Inc. to Present AeA Micro Cap Financial Conference on May 8-9, 2006
• CEVA, Inc. to Present at 10th Annual Needham Growth Stock Conference, January 10, 2008
• CEVA, Inc. to Present at 12th Annual Needham Growth Stock Conference on January 12
• CEVA, Inc. to Present at 13th Annual Needham Growth Conference on January 11
• CEVA, Inc. to Present at 15th Annual Needham Growth Conference on January 15
• CEVA, Inc. to Present at 16th Annual Needham Growth Conference on January 14
• CEVA, Inc. to Present at AeA Classic Financial Conference on November 8
• CEVA, Inc. to Present at AeA Classic Financial Conference, November 4-5
• CEVA, Inc. to Present at AeA Classic Financial Conference, November 6-7
• CEVA, Inc. to Present at AeA Classic Financial Conference, November 7-8, 2006
• CEVA, Inc. to Present at AeA Micro Cap Financial Conference, May 7, 2007
• CEVA, Inc. to Present at Barclays Global TMT Conference and Exane BNP Paribas' Disruptive Tech Investor's Conference
• CEVA, Inc. to Present at Brigantine Advisors’ Tech Trends in 2010 Conference, December 10
• CEVA, Inc. to Present at C.E. Unterberg, Towbin Emerging Growth Conference, July 11-12, 2006
• CEVA, Inc. to Present at CIBC World Markets Consumer Semiconductor 1-on-1 Conference
• CEVA, Inc. to Present at Collins Stewart Growth Conference
• CEVA, Inc. to Present at G6: ThinkEquity’s 6th Annual Growth Conference
• CEVA, Inc. to Present at Kaufman Bros. 12th Annual Investor Conference
• CEVA, Inc. to Present at NASDAQ OMX and Oppenheimer 14th Annual Israeli Equities Conference
• CEVA, Inc. to Present at Ninth Annual Needham Growth Conference, January 10, 2007
• CEVA, Inc. to Present at Oppenheimer Annual Communications, Technology & Internet Conference
• CEVA, Inc. to Present at Oppenheimer Annual Technology, Media and Telecommunications Conference
• CEVA, Inc. to Present at RBC Capital Markets North American Technology Conference
• CEVA, Inc. to Present at RBC Capital Markets Technology, Media & Communications Conference
• CEVA, Inc. to Present at Rodman & Renshaw Annual Global Investment Conference
• CEVA, Inc. to Present at the 11th Annual Needham Growth Stock Conference
• CEVA, Inc. to Present at the 23rd Annual Needham Virtual Growth Conference
• CEVA, Inc. to Present at the 25th Annual Needham Growth Conference
• CEVA, Inc. to Present at the Kaufman Bros. 11th Annual Investor Conference
• CEVA, Inc. to Present at the TechAmerica AeA Classic Financial Conference, November 3
• CEVA, Inc. to Present at the William Blair 3rd Annual Emerging Growth Stock Conference
• CEVA, Inc. to Present at Upcoming Conferences
• CEVA, Inc. to Present at Upcoming Conferences
• CEVA, Inc. to Present at Upcoming Conferences
• CEVA, Inc. to Present at Upcoming Conferences
• CEVA, Inc. to Present at Upcoming Conferences
• CEVA, Inc. to Present at Upcoming Conferences
• CEVA, Inc. to Present at Upcoming Financial Conferences
• CEVA, Inc. to Present at Upcoming Investor Conferences
• CEVA, Inc. to Present at Upcoming Investor Conferences
• CEVA, Inc. to Present at Upcoming Investor Conferences
• CEVA, Inc. to Present at Upcoming Investor Conferences
• CEVA, Inc. to Present at Upcoming Investor Conferences
• CEVA, Inc. to Present at Upcoming Virtual Investor Conferences
• CEVA, Inc. to Present at Upcoming Virtual Investor Conferences
• CEVA, Inc. to Present at Upcoming Virtual Investor Conferences
• CEVA, Inc. to Present at William Blair Emerging Growth Stock Conference
• CEVA, Inc. to refrain from further proposals to acquire MIPS operating business
• CEVA, Inc. Will Receive $2.5 Million From U-Blox AG
• CEVA, Keysight Technologies Demonstrate PentaG™ 5G NR IP Platform for Enhanced Mobile Broadband at Mobile World Congress 2018
• CEVA, NXP Software Partner to Deliver Enhanced HD Voice Processing Solution based on the CEVA-TeakLite-4 DSP
• CEVA, Rubidium Partner to Deliver Speech Processing Solutions based on the CEVA-TeakLite Family of DSPs
• CEVA, SMIC and Brite Semiconductor Partner to Provide Hard Macro Versions of CEVA DSP Cores and Platforms
• CEVA-TeakLite DSP License Extended By STMicroelectronics For Next Generation DSL Central Office Chipsets
• CEVA-TeakLite-II Boosts Performance and Functionality of CEVA’s Most Deployed DSP Core
• CEVA-TeakLite-III Becomes Industry’s First DSP Core to Offer Optimized Skype SILK Super Wideband Speech Codec
• CEVA-TeakLite-III DSP Core Powers HD Audio in Sunplus’ New Blu-ray SoCs
• CEVA-TeakLite-III DSP Licensed to Toshiba
• CEVA-TeakLite-III DSP Offers First IP Core Approved for Dolby MS11 Multistream Decoder
• CEVA-TeakLite-III DSP Receives DTS-HD Master Audio Logo Certification
• CEVA-XC DSP for Next Generation 4G Wireless Products Licensed to Intel
• CEVA-XM4 Imaging and Vision DSP Named “Best Processor IP of 2015” by The Linley Group
• CEVA-XM6 Computer Vision and Deep Learning Platform Honored by Vision Systems Design 2018 Innovators Awards Program
• Chip Express Announces Successful Deployment of Structured ASIC Products Incorporating ParthusCeva PLL IP
• Chipnuts Technology Selects CEVA Audio Subsystem and Software for Low-Power Multimedia Processors
• Combination of Parthus and Ceva – Date Fixed for Court Hearing to Approve the Scheme of Arrangement
• Combination of Parthus and Ceva – Irish High Court Approves Scheme of Arrangement; Date of Closing of Combination to be Announced
• Combination of Parthus and Ceva – Parthus Shareholders and Optionholders Approve Scheme of Arrangement
• Combination of Parthus and Ceva Completed Today; ParthusCeva Launches Operations
• Combination of Parthus and Ceva to Close on 1 November 2002
• Combination of Parthus and Ceva: Clarificaton & Correction
• Comsys Announces Integrated GSM / GPRS Baseband IP Solution Based On ParthusCeva’s XpertTeak Platform
• CORRECTION: CEVA, Inc. Earnings Date Correction – Second Quarter 2022 Earnings Release and Conference Call Set for August 9
• Cortus and RivieraWaves Partner to Provide Complete Bluetooth Low Energy and Classic Bluetooth BR/EDR Low Power Platforms
• Cuan completes PDA project with Parthus Technologies
• CYIT Licenses CEVA-TeakLite-4 Audio/Voice DSP for Mobile SoCs
• Cypher Partners with CEVA to Offer Innovative Noise Reduction Solution for Mobile, Wearables and Voice-activated Devices
• CyweeMotion Partners with CEVA to Offer Complete Sensor Fusion Solution for Mobile and Wearables
• Date Of Shareholder And Optionholder Meetings Of Parthus To Give Effect To The Combination Of Parthus And Ceva
• DeepGlint Harness the Power of CEVA-XM4 Imaging and Vision Platform for Intelligent Video Analytic and ADAS Solutions
• DigiBee Partners with CEVA for Multimedia and Baseband Platform Solutions
• Dolby MS12 Multistream Decoder Now Supported and Approved on CEVA’s Audio DSP
• DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications
• DSP Group , the leading developer and marketer of high-performance, cost-effective, licensable digital signal processing cores, today announced that it has been named the “clear leader” in the embedded DSP cellular handset phone market, in a recent market
• DSP Group and ART Announce Availability of Advanced Speech Recognition Capabilities for SmartCores™
• DSP Group and AXYS Design Boost Pre-Silicon Design and Verification with New TeakLite Model and Multicore Debugging Support
• DSP Group License CEVA Audio DSP for HDClear Voice Enhancement Solution
• DSP Group Licenses ParthusCeva’s Bluetooth Technology Targeting Residential Wireless Systems
• DSP Group Unveils Next Generation DSP Architecture Family- Scalable, Extendible and Licensable
• DSP Group, Inc. Designates Synopsys Professional Services as System-on-a-Chip Design Center for SmartCores™ DSP Family
• DSP Group, Inc. the leader in the development and licensing of high-performance, low-power, digital-signal-processor (DSP) cores, today introduced its VoPKey™, a licensable design that offers a complete solution for Voice-over-Packet (Vo
• DSP Group, Inc., a leading company in the development of high-performance, cost-effective, licensable Digital Signal Processor (DSP) cores, today announced that it has been named the worldwide leader with the largest market share of DSP Core Intellectual
• DSP Group, Inc., a leading developer and marketer of high-performance, cost-effective, programmable digital signal processing cores, today announced that Oki Electric Industry Co., Ltd. has licensed the Teak® DSP Core from DSP Group’s line of cores for u
• DSP Group, the leading company in the development of high-performance, low-power, licensable Digital Signal Processors (DSPs), today unveiled its 200MHz, fully synthesizable TeakLite®-based chip.
• Endeavor Intertech Corporation, an innovative developer of high performance processors, co-simulation interfaces and tools for hardware and software verification, and DSP Group, Inc., a leading developer and marketer of high-performance, cost-effective, l
• Enea and CEVA Announce Enea OSE ck Real-Time Operating System for CEVA-X and CEVA-TeakLite-III DSP Architectures
• eSilicon Announces Successful Deployment of ASIC Chip Incorporating ParthusCeva PLL IP
• Espressif Licenses and Deploys CEVA Bluetooth in ESP32 IoT Chip
• Express Logic Announces ThreadX RTOS for CEVA-TeakLite III DSP Core
• Fifth-Generation CEVA Imaging & Vision Technology Simplifies Delivery of Powerful Deep Learning Solutions on Low-Power Embedded Devices
• Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
• Fujitsu Limited Licences Parthus Bluetooth Technology to Power Next Generation Wireless Devices
• GCT Semiconductor Licenses CEVA Bluetooth Low Energy IP for its LTE IoT SoC
• Goldman Sachs takes shareholding in Parthus (formerly SSL)
• Goodix License and Deploy CEVA Bluetooth Low Energy IP in SoCs Targeting Wearables, Mobile Devices, the Internet of Things
• HILLCREST LABS AND LG RENEW LICENSE FOR SMART TV TECHNOLOGY
• Himax, emza and CEVA Partner to Create Ultra-Low Power, Always-On Vision Sensor for IoT
• Hitachi Selects Industry-Leading Bluetooth™ Platform from Parthus to Power Next Generation Mobile Internet Devices
• HMicro Licenses and Deploys CEVA Wi-Fi IP for Healthcare and IoT Devices
• Horizon 2020 Funding Granted to FANCI Project For Multi-Modal Human-Machine Technologies
• iCatch Technology Selects CEVA Imaging and Vision DSP for Digital Video and Image Product Line
• Icom License CEVA DSP for Wireless Baseband Applications
• IDT (Integrated Device Technology, Inc.), a leading communications IC company, and VoicePump, Inc., a wholly owned subsidiary of DSP Group, Inc., today announced a strategic partnership to deliver a voice-enabled asymmetric digital subscriber line (ADSL)
• iFLYTEK On-Device Speech Recognition Software Now Available For CEVA’s Ultra-Low Power Audio/Voice DSPs
• Independent BDTI Benchmarks Recognize CEVA-TeakLite-III as Most Area Efficient and Energy Efficient of all Processors in Its Class
• INDILINX Licenses CEVA SATA 3.0Gbps Device IP for Solid State Drive Applications
• Infineon Technologies Licenses Parthusceva’s TeakLite DSP Core
• Innochip Launches Digital Audio Broadcast Chip Powered by ParthusCeva’s Teak DSP Core
• Inomize Selected by CEVA as Approved Design Center
• InPlay Technologies Licenses and Deploys CEVA’s Bluetooth® 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
• InterDigital Licenses CEVA-TeakLite DSP Core for Multi-mode Baseband Platform IP
• Intersil and ParthusCeva Announce Wireless LAN Licensing Partnership
• Introducing The NEW CEVA-X – The World's Most Efficient Processor Architecture for Baseband Applications
• Inuitive Selects CEVA-XM4 Intelligent Vision DSP for Next Generation 3D Computer Vision SoC
• IRIDA Labs Partners with CEVA to Offer Advanced Computer Vision Algorithms for Ultra Low Power Devices Using CEVA-MM3101 Imaging & Vision DSP
• ITRI Selects CEVA-XC DSP for 4G Small Cell Base Stations
• Japan Radio Co. Licenses CEVA-Teak DSP Core For Baseband Radio Communications
• K-micro Licenses CEVA Serial Attached SCSI (SAS) PHY for Enterprise Storage Applications
• K-Micro Licenses CEVA’S 90nm 3.0Gbps Serial ATA Technology to Enable Topaz Sub-System for Storage Applications
• K-Micro Licenses CEVA’s Fully Integrated Ultra-Low Power VoIP Platform for New CPE Gateways and IP Phones
• Kawasaki Microelectronics Partners with CEVA to Add Fully Compliant 1.5Gbps Serial ATA Macro to its 0.13um ASIC IP Portfolio
• Korea’s Telson Licenses ParthusCeva’s XpertTeak SoC For Cellular Handsets
• Leadcore Technology License CEVA DSP Technologies for Mobile Devices
• LG Electronics Selects CEVA Imaging and Vision DSP for Mobile Devices
• Location Field Trials Demonstrate The Breakthrough Indoor Performance Of Parthus’ Navstream 3000 Location Platform
• Macronix Selects ParthusCeva’s Bluetooth™ Platform to Power Bluetooth Connected Portables
• MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM
• Maxim Integrated Products licenses Parthus NavStream GPS RF multi-chip to enable unrivalled location accuracy for Mobile-Internet devices
• Maxim’s Dynamic Speaker Management Technology Running on the CEVA-TeakLite-4 Ultra-Low-Power DSP Provides the Ultimate Sound Experience from Micro Speakers
• Maxscend Partners with CEVA to Offer Complete Wi-Fi and Bluetooth Solutions for Mobile Platforms, Wearables and IoT Devices
• MediaTek Licenses CEVA-X DSP Core and Subsystem from CEVA
• Merger of Parthus Technologies and the IP Licensing Business of DSP Group
• Michael Boukaya Promoted to Chief Operating Officer of CEVA, Inc.
• mimoOn and CEVA to Demonstrate Single-Core Real-time LTE UE Platform at Mobile World Congress
• Mindspeed 3G/4G/LTE Baseband Solution Deploys CEVA DSP Processor to Deliver Best-in-Class Performance for Next-Generation Base Stations
• Mindspeed and CEVA Collaborate to Bring Software-Defined Radio Technology to LTE Wireless Infrastructure Market
• Mindspeed® Selects CEVA-X1641 DSP and CEVA-XS1200A Subsystem for High Performance Next Generation Network Applications
• MorningCore Technology License CEVA DSP for High Performance Wireless and Automotive Communication Platforms
• MoSys and CEVA Partner to Deliver Integrated SATA 3.0 PHY and Controller IP Solution
• MVSILICON License and Deploy CEVA Bluetooth® IP in its latest Wireless Audio Platform
• Nations’ Latest BLE 5 IC Powered By CEVA Bluetooth® Low Energy IP
• NemeriX Licenses CEVA GPS 4000 IP And Announces Assisted GPS Chipset Targeting Mobile Phone Market
• New CEVA Executive Staff To Present At AeA Micro Cap Financial Conference On May 16-17, 2005
• New technology consortium formed to develop innovative integrated Bluetooth Low Energy modules for SMEs
• Nextchip License CEVA Imaging and Vision Platform for ADAS Vision System
• Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC
• Novatek Adopts CEVA Audio/Voice DSP and Software for Smart TV SoCs
• Novatek Adopts CEVA’s Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC
• Novatek Adopts CEVA-MM3101 Imaging and Vision DSP for Its Next-Generation SoCs
• Novatek Licenses CEVA-XM4 Imaging and Vision DSP for Embedded Visual Intelligence
• Nuance Voice Activation Technology Now Available for CEVA-TeakLite Family, World’s Lowest Power Audio/Voice DSPs
• Nufront Selects CEVA DSP Core for Wireless Baseband Chipsets
• Nurlink Completes First Call on Commercial NB-IoT Network with its CEVA-powered eNB-IoT SoC
• Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP
• Oki Electric Licenses and Deploys CEVA DSP Core to Power Digital Audio MP3 Consumer Chip Solution
• ON Semiconductor License CEVA Imaging and Vision Platform for Automotive ADAS
• Optek Licenses and Deploys CEVA Bluetooth® IP in its latest Multimedia Platform
• Oticon Licenses and Deploys CEVA Bluetooth Low Energy Technology in Breakthrough Hearing Aid
• PA Consulting Group and CEVA Partner for Software-Based 3G Solution Targeting Wireless Infrastructure
• Parthus (formerly SSL) Acquire World Leading Global Positioning System (GPS) from Symmertricom Parthus’ Leading Position in mCommerce Strengthened
• Parthus (formerly SSL) and Fraunhofer Develop Internet Audio Encoding and Decoding Solution
• Parthus (formerly SSL) Forms Strategic Partnership with ARM to Develop Technology for Next-Generation Mobile Internet Devices
• Parthus (formerly SSL) Launches System-Level Bluetooth™ IP for Portable Internet Appliances
• Parthus (formerly SSL) Names Seasoned Semiconductor Executive President of US Operations and V.P. of Worldwide Sales
• Parthus (formerly SSL) To Provide 65 Jobs in New Belfast IC Design Centre
• Parthus and 1st Silicon License Agreement Provides New Foundry Source for System-On-Chip IP
• Parthus and Intertrust Partner to Integrate Digital Rights Management into Parthus’ MediaStream Platform™
• Parthus and STMicroelectronics Agree to Multi-Year Licensing Arrangement for the Complete Portfolio of Mobile Internet Technologies & Platforms
• Parthus and Ubinetics Form Broad Reaching Strategic Alliance Around Multi-Mode 2.5g/3g Wireless Technology
• Parthus and UMC Announce Foundry Program for Advanced Bluetooth™ Radio Solutions that power Next Generation Mobile Internet Devices
• Parthus Announces Agreement with STMicroelectronics for Development of Next Generation Bluetooth™
• Parthus Announces Availability of New Editions of the Infostream Platform for Microsoft Based Smartphones and Pocket PC PDA’s
• Parthus Announces Intention to Acquire Remaining Minority Interest in Silicon Systems Design from STMicroelectronics in Exchange for a Shareholding in Parthus Technologies PLC
• Parthus Announces Streamlining Of Two Product Lines To Focus Resources On Growth Opportunities
• Parthus Announces the Launch and Licensing of its Latest Bluetooth™ Offering – BlueStream™ Release 6
• Parthus appoints Chief Operating Officer Kevin Fielding to Board
• Parthus BlueStream Platform Receives Independent Qualification for Bluetooth™ 1.1
• Parthus Bluestream™ Platform To Shine At Bluetooth Congress
• Parthus Bolsters Global Team with Appointment of Amory Schwartz as Vice President of Strategic Business and Lorraine Whelan as Director of Investor Relations
• Parthus Designs £3 Million Audio Chip for New Mercedes
• Parthus Develops Seamless Interface to Memory Stick ®, Greatly Enhancing the Capacity of Next Generation Mobile Internet Devices
• Parthus Expands Executive Team with Key Appointments
• Parthus founder named Irish Technology Entrepreneur of the year
• Parthus is one of “Europe’s 50 Hottest Tech Firms” says TIME Magazine
• Parthus Joins Bluetooth™ Consortium
• Parthus Joins FTSE 250 Index
• Parthus Joins Java Community Process (JCP) Expert Group to Define Java™ API for Next Generation Mobile Internet Platforms
• Parthus Joins SyncML Initiative to Create a Common Protocol for Sharing Information Seamlessly Between Wireless Devices
• Parthus Joins Wireless Multimedia Forum to Promote Industry-Wide Interoperability for Media Content Across Wireless Devices
• Parthus Launch the Ultra Small and Ultra Low Power Bluestream Bluetooth™ Platform
• Parthus Launches and Licenses NavStream 3000 GPS Platform Enabling Location Determination in the Most Challenging of Indoor and Urban Canyon Environments
• Parthus launches InfoStream, the Industry’s Most Advanced Mobile Internet-on-a-chip Platform for Next Generation SmartPhone Devices
• Parthus Launches MachStream, The Industry’s Most Power Efficient Technology for Accelerating Key Mobile Internet Applications
• Parthus Launches NavStream™, the Industry’s most Accurate Handset GPS Technology for Next Generation Mobile-Internet Devices
• Parthus launches the MediaStream- a fully programmable Internet-Audio Platform to power a wide array of audio applications from speech recognition to MP3 enabled portable players and mobile phones
• Parthus Licenses NavStream™ Platform to ARM Enabling GPS Integration into Next Generation Mobile Phones and Automotive
• Parthus MediaStream DSP Selected by NVIDIA
• Parthus MobiStream GPRS Platform Receives Industry Accolades at 2001 3GSM World Congress for Solving Challenges of 2.5G Deployment
• Parthus Opens Advanced New R&D Centre at Limerick, Ireland as Worldwide Software Headquarters for Wireless Software and Smartphone Development
• Parthus Opens R&D Center in Caen, France focused on developing Advanced Multi-Mode Radio Technology, a key component of next generation Mobile Internet Devices
• Parthus Recognized as World’s Fastest Growing Semiconductor Intellectual Property Company
• Parthus Technologies Accelerates the Use of Java™ Technology in Next-Generation Wireless Devices Through Licensing Agreement with Sun Microsystems
• Parthus Technologies acquires GSM/GPRS Division from Frontier Design Inc
• Parthus Technologies and DSP Group Announce Receipt of Favourable IRS Ruling
• Parthus Technologies and DSP Group Provide Update on Proposed Merger
• Parthus Technologies And Wipro Enter Strategic Partnership
• Parthus Technologies Announces a Breakthrough in PLL IP Delivery, Putting Design of Custom Clock Synthesis Cores in the Hands of Digital Designers
• Parthus Technologies Announces the Initial Public Offering Price of its Ordinary Shares and ADSs
• Parthus Technologies considers follow-on offering
• Parthus Technologies forms Equity Alliance with ARM
• Parthus Technologies Joins EEMBC for Embedded Java Benchmark Standards and Certifications
• Parthus Technologies named in Red Herring Magazine’s Top 100
• Parthus Technologies Partners with Insignia to Deliver Best-in-class Java-based Software and Hardware Platform for Wireless Devices
• Parthus Technologies plc
• Parthus Technologies plc Ammendment to First Quarter 2002 Results Date
• Parthus Technologies plc and DSP Group, Inc Confirm Discussions
• Parthus Technologies plc Announce Results for the Third Quarter and Nine Months Ended September 30, 2001
• Parthus Technologies plc Announces Filing For Its Initial Public Offering
• Parthus Technologies Plc Announces Results for the Fourth Quarter and Full Year Ended December 31, 2001
• Parthus Technologies plc Announces Results for the Quarter Ended March 31 2001
• Parthus Technologies Plc Announces Results For The Quarter Ended March 31, 2002
• Parthus Technologies plc announces results for the third quarter ended September 30, 2002
• Parthus Technologies plc Announces Strong Second Quarter and Interim Results for the six months ended June 30, 2001
• Parthus Technologies Plc Announces Strong Second Quarter and First Half Results
• Parthus Technologies plc Annual General Meeting 2002
• Parthus Technologies plc confirms expectations for second quarter
• Parthus Technologies Plc follow-on offering priced at £2.10 per Ordinary Share / $30.05 per ADS
• Parthus Technologies plc Second Quarter and Interim
• Parthus Technologies to Acquire Chicory Systems
• Parthus Technolologies and Telematix Corporation announce a Strategic Partnership for Developing and Marketing Wireless LAN Technology
• Parthus Technolologies Announces the Launch of Wireless-LAN Platform Targeting the 802.11 Market
• Parthus To Unveil In8stream™ Platform At 802.11 Planet Conference In Philadelphia
• Parthus unveils range of Bluetooth™ demonstrations including Industry’s first Bluetooth enabled MP3 solution for peer-to-peer file sharing
• Parthus Unveils Range of Innovative Bluetooth™ Applications Demonstrating Unique Convergence of Multiple Parthus Mobile Internet Platforms
• ParthusCeva 2003 Guidance Conference Call Rescheduled
• ParthusCeva and ARM Collaborate to Create Common Development Environment for Hybrid CPU/DSP-Based System-on-Chip
• ParthusCeva and AXYS Introduce Multi-Core Verification Support for Teak DSP Core
• ParthusCeva and Cirrus Logic Form Relationship Targeting the Home Entertainment Market
• ParthusCeva Announces Appointment of Chief Financial Officer and Vice-President of Business Development & Strategy
• ParthusCeva Announces Architecture Standard for Hybrid DSP/RISC-Based System-on-Chip for ARM Environment
• ParthusCeva Announces ChannelStream Serial ATA (SATA) Platform
• ParthusCeva Announces Executive Management Changes to Enhance North American Focus and Post-Merger Integration of the Company
• ParthusCeva Announces Extensive Upgrade to PLLXpert Online and the Addition of TSMC 0.13um PLL Compilers
• ParthusCeva Announces Preliminary Results for the Fourth Quarter of 2002
• ParthusCeva Announces Results For The First Quarter Ended March 31 2003
• ParthusCeva Announces Results for the Fourth Quarter and Year Ended December 31, 2002
• ParthusCeva Announces Results for the Second Quarter Ended June 30, 2003
• ParthusCeva Announces Results for the Third Quarter Ended September 30, 2003
• ParthusCeva Appoints Chet Silvestri as Chief Executive Officer
• ParthusCeva Changes Name to CEVA, Inc.
• ParthusCeva Delivers World’s First “Drop-In” Macro for Bluetooth™
• ParthusCeva Demonstrates First Licenseable 802.11a IP Platform Running Over 5 GHz Link
• ParthusCeva First Quarter 2003 Earnings Release and Conference Call
• ParthusCeva Launches XpertTeak Based Digital Audio Extensions and Development Environment for Consumer Applications
• ParthusCeva Named as Member of IBM Blue Logic IP Collaboration Program
• ParthusCeva Provides Guidance for the Year 2003
• ParthusCeva Provides Guidance for the Year 2003
• ParthusCeva Schedules Conference Call and Webcast to Provide an Update on the Merger and Related Guidance
• ParthusCeva Schedules Conference Call to Provide an Update on the Merger and Related Guidance
• ParthusCeva Second Quarter 2003 Earnings Release and Conference Call
• ParthusCeva SmartCores™ are Foundation of Wireless Modems from Korea’s EoNex
• ParthusCeva Third Quarter 2003 Earnings Release and Conference Call
• ParthusCeva’s DSP Cores Licensed by STMicroelectronics for DSL Chipsets
• ParthusCeva, Inc. to Change Name to CEVA, Inc.
• ParthusCeva, Mentor Graphics and Accelerated Technology Announce Nucleus RTOS Support for Teak DSP Core
• Percello Licenses CEVA DSP Core for Femtocell Basestations
• Picocom License CEVA DSP for 5G New Radio Infrastructure SoC
• PiSoft Partners with Rockchip and CEVA to Develop 360 Degree Panoramic Camera Solution
• PrairieComm selects Bluetooth™ technology from Parthus to power wireless chipsets for next generation Mobile Internet devices
• PrairieComm, Inc., a leading provider of chipsets for wireless handsets from the world’s leading consumer electronics manufacturers, and DSP Group Inc., the leader in the development and licensing of high-performance, cost-effective digital signal process
• QinetiQ and Parthus to Collaborate on Developing Applications for NavStream 3000 GPS Location Platform
• Quadros RTXC™ RTOS Now Available for Market-Leading DSP Cores from CEVA
• RadioFrame Networks License CEVA-X DSP Core and Subsystem to Power Femtocell 2G/3G Wireless Base Stations
• Ramon Chips Licenses CEVA-X DSP for High Performance Computing for Space Applications
• RDA Microelectronics Leverages CEVA Bluetooth IP to Deliver Ultra Low-Power, Single-Chip Bluetooth 2.1 + EDR Solution
• REMINDER: CEVA Fourth Quarter and Full Year 2017 Earnings Release and Conference Call Set for February 6th
• Reminder: CEVA Fourth Quarter and Year End 2007 Earnings Release and Conference Call Set for January 31
• Reminder: CEVA Schedules First Quarter 2006 Earnings Release and Conference Call for April 25
• Reminder: CEVA Schedules Second Quarter 2006 Earnings Release and Conference Call for July 20
• Reminder: CEVA Schedules Third Quarter 2006 Earnings Release and Conference Call for October 25
• Reminder: CEVA, Inc. First Quarter 2007 Earnings Release and Conference Call on May 1st
• Reminder: CEVA, Inc. First Quarter 2008 Earnings Release and Conference Call Set for April 29
• REMINDER: CEVA, Inc. First Quarter 2009 Earnings Release and Conference Call Set for May 5
• REMINDER: CEVA, Inc. First Quarter 2010 Earnings Release and Conference Call Set for April 29
• REMINDER: CEVA, Inc. First Quarter 2011 Earnings Release and Conference Call Set for April 27
• REMINDER: CEVA, Inc. First Quarter 2012 Earnings Release and Conference Call Scheduled for May 02
• REMINDER: CEVA, Inc. First Quarter 2013 Earnings Release and Conference Call Set for May 2
• REMINDER: CEVA, Inc. First Quarter 2014 Earnings Release and Conference Call Set for April 30
• REMINDER: CEVA, Inc. First Quarter 2015 Earnings Release and Conference Call Set for May 4th
• REMINDER: CEVA, Inc. First Quarter 2016 Earnings Release and Conference Call Set for May 2nd
• REMINDER: CEVA, Inc. First Quarter 2017 Earnings Release and Conference Call Set for May 4
• REMINDER: CEVA, Inc. First Quarter 2018 Earnings Release and Conference Call Scheduled for May 9
• REMINDER: CEVA, Inc. First Quarter 2019 Earnings Release and Conference Call Scheduled for May 6th
• REMINDER: CEVA, Inc. First Quarter 2020 Earnings Release and Conference Call Scheduled for May 11
• REMINDER: CEVA, Inc. First Quarter 2021 Earnings Release and Conference Call Scheduled for May 10
• REMINDER: CEVA, Inc. Fourth Quarter and 2013 Earnings Release and Conference Call Set for January 30
• REMINDER: CEVA, Inc. Fourth Quarter and Full Year 2018 Earnings Release and Conference Call Scheduled for February 13
• REMINDER: CEVA, Inc. Fourth Quarter and Full Year 2019 Earnings Release and Conference Call Scheduled for February 18
• Reminder: CEVA, Inc. Fourth Quarter and Year End 2006 Earnings Release and Conference Call on January 25th
• Reminder: CEVA, Inc. Fourth Quarter and Year End 2008 Earnings Release and Conference Call Set for February 3
• REMINDER: CEVA, Inc. Fourth Quarter and Year End 2009 Earnings Release and Conference Call Set for January 28
• REMINDER: CEVA, Inc. Fourth Quarter and Year End 2010 Earnings Release and Conference Call Set for January 31
• REMINDER: CEVA, Inc. Fourth Quarter and Year End 2011 Earnings Release and Conference Call Scheduled for January 31
• REMINDER: CEVA, Inc. Fourth Quarter and Year End 2012 Earnings Release and Conference Call Set for January 30
• REMINDER: CEVA, Inc. Fourth Quarter and Year End 2014 Earnings Release and Conference Call Set for February 3rd
• REMINDER: CEVA, Inc. Fourth Quarter and Year End 2015 Earnings Release and Conference Call Set for February 3
• Reminder: CEVA, Inc. Q2 2007 Earnings Release and Conference Call on July 24th
• Reminder: CEVA, Inc. Q3 2007 Earnings Release and Conference Call on November 1st
• REMINDER: CEVA, Inc. Second Quarter 2008 Earnings Release and Conference Call Set for July 23
• REMINDER: CEVA, Inc. Second Quarter 2009 Earnings Release and Conference Call Set for July 29
• REMINDER: CEVA, Inc. Second Quarter 2010 Earnings Release and Conference Call Set for July 28
• REMINDER: CEVA, Inc. Second Quarter 2011 Earnings Release and Conference Call Set for July 26
• REMINDER: CEVA, Inc. Second Quarter 2012 Earnings Release and Conference Call Scheduled for July 31
• REMINDER: CEVA, Inc. Second Quarter 2013 Earnings Release and Conference Call Set for July 31
• REMINDER: CEVA, Inc. Second Quarter 2014 Earnings Release and Conference Call Set for July 31
• REMINDER: CEVA, Inc. Second Quarter 2015 Earnings Release and Conference Call Set for July 30
• REMINDER: CEVA, Inc. Second Quarter 2016 Earnings Release and Conference Call Set for August 3
• REMINDER: CEVA, Inc. Second Quarter 2018 Earnings Release and Conference Call Scheduled for August 7
• REMINDER: CEVA, Inc. Second Quarter 2019 Earnings Release and Conference Call Scheduled for August 8
• REMINDER: CEVA, Inc. Second Quarter 2020 Earnings Release and Conference Call Scheduled for August 10
• Reminder: CEVA, Inc. Third Quarter 2008 Earnings Release and Conference Call Set for October 29
• REMINDER: CEVA, Inc. Third Quarter 2009 Earnings Release and Conference Call Set for October 28
• REMINDER: CEVA, Inc. Third Quarter 2010 Earnings Release and Conference Call Set for October 26
• REMINDER: CEVA, Inc. Third Quarter 2011 Earnings Release and Conference Call Set for October 27
• REMINDER: CEVA, Inc. Third Quarter 2012 Earnings Release and Conference Call Scheduled for November 1
• REMINDER: CEVA, Inc. Third Quarter 2013 Earnings Release and Conference Call Set for October 30
• REMINDER: CEVA, Inc. Third Quarter 2014 Earnings Release and Conference Call Set For October 30
• REMINDER: CEVA, Inc. Third Quarter 2015 Earnings Release and Conference Call Set for November 2
• REMINDER: CEVA, Inc. Third Quarter 2016 Earnings Release and Conference Call Set for November 2
• REMINDER: CEVA, Inc. Third Quarter 2017 Earnings Release and Conference Call Set For November 1
• REMINDER: CEVA, Inc. Third Quarter 2018 Earnings Release and Conference Call Set for November 8
• REMINDER: CEVA, Inc. Third Quarter 2019 Earnings Release and Conference Call Set for November 7
• REMINDER: CEVA, Inc. Third Quarter 2021 Earnings Release and Conference Call Scheduled for November 9th
• Renesas Technology Deploys CEVA Bluetooth IP in High Volume Consumer and Automotive Chipsets
• Renesas Technology Licenses CEVA’s Xpert-Blue Platform And Achieves Bluetooth 1.2 Certification
• Renesas Technology Licenses ParthusCeva’s TeakLite DSP Core for Cellular Handsets
• Retune DSP’s Wake Word Engine Now Available for CEVA Audio/Voice DSPs
• RivieraWaves Achieves 802.11n Certification; Announces Wi-Fi 802.11ac Silicon IP
• RivieraWaves Adds 802.11n and 802.11ac Silicon IP to Portfolio
• RivieraWaves and CSEM team up to provide the world’s lowest power Bluetooth Smart integrated solution
• RivieraWaves announce the world’s first Bluetooth low energy qualified baseband IP
• RivieraWaves Announces its Wi-Fi Partnership with Celeno
• RivieraWaves announces the world’s first Bluetooth 3.0 qualified baseband IP
• RivieraWaves announces the world’s first qualified baseband IP for dual mode Bluetooth 4.0
• RivieraWaves licensed Bluetooth low energy IP to Renesas Electronics.
• RivieraWaves Licenses its Bluetooth Smart 4.1 Intellectual Property to Dialog Semiconductor
• RivieraWaves to address IP and wireless market
• RivieraWaves wins SAME Conference 2011 best paper award
• Rockchip and CEVA Extend Partnership to Include CEVA-XM4 Intelligent Vision DSP
• Rockchip Deploys CEVA MM2000 Programmable Multimedia Solution for Android-Powered HD Multimedia Processors
• Samsung Licenses CEVA’s Newest Generation CEVA-X DSP Core
• Sanechips (ZTE Microelectronics) Licenses CEVA-X1 IoT Processor for NB-IoT Connected Devices
• SatixFy licenses CEVA-XC DSP for Broadband Satellite Applications
• Sckipio Licenses and Deploys CEVA-XC Communications DSP in World’s First G.fast Chipsets
• Sequans Licenses CEVA 5G Modem IP for Broadband IoT Platform
• Sequans Selects CEVA DSP Core for LTE / WiMAX Chipsets
• SGA Innovations Partners with CEVA to offer a DSP-based Wireline and Wireless Communication Solution for the IoT Market
• Shanghai Frequen Licenses and Deploys CEVA Bluetooth Low Energy IP in New IoT Product Line
• Shanghai InfoTM Microelectronics Licenses CEVA-TeakLite-4 Audio/Voice DSP
• Sharp Licenses Parthus MachStream Java Acceleration Platform For Use in Advanced System-on-Chip Products
• Sharp Microelectronics of the Americas Licenses Parthus’ InfoStream Platform for Complete System-on-Chips to Power Next Generation Mobile Computing Devices
• Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for 8 Microphone Far-Field Voice Pickup Applications
• Shipment Volumes of CEVA DSP-powered Cellular Baseband Processors Surpass Qualcomm, Texas Instruments and Mediatek
• SiFive and CEVA Partner to Bring Machine Learning Processors to Mainstream Markets
• SiFlower Licenses and Deploys CEVA’s 802.11ac Wi-Fi IP in its Smart Home Access Point SoC
• SigmaStar Deploys CEVA Computer Vision and Deep Learning Platform in its Intelligent Camera SoC
• Sigmatel Licenses Parthus Mediastream Platform to Power Next Generation Mobile Internet Audio and Home Entertainment Applications
• Silicon Laboratories Deploys CEVA-Teak DSP Core in Industry’s Most Highly-Integrated Single-Chip Phone for GSM/GPRS Handsets
• Silicon Systems plc announces its intention to change its name to Parthus Technologies and to float on the London Stock Exchange and the Nasdaq National Market
• Silterra Adds ARM Core to Its IP Portfolio
• Silver Spring Networks Adopts CEVA Technology for Internet-of-Things Communications Platform
• Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs
• SKAIChips License Ceva Bluetooth IP for Electronic Shelf Label IC
• Socionext Licenses and Deploys CEVA Imaging and Vision DSP for Milbeaut™ Image Processors
• Sonova License and Deploy CEVA Bluetooth® IP in SWORD™ 3.0 Wireless Chip for Hearing Aids
• Spreadtrum Commences Shipments Of GSM/GPRS Chip Powered By CEVA-TeakLite DSP Core To Chinese Market
• Spreadtrum Communications Licenses ParthusCeva High Performance TeakLite DSP Core Technology
• Spreadtrum Launches World’s First Chinese 3G Chipset Powered By CEVA-Teak DSP Core
• Spreadtrum Licenses CEVA-TeakLite-4 Audio/Voice DSP
• Spreadtrum Licenses CEVA-XC DSP for LTE Baseband
• Spreadtrum Ships Thirty Millionth CEVA-powered Baseband Chipset
• Spreadtrum Utilizes CEVA-X DSP to Develop TD-SCDMA Baseband Processors for 3G Wireless Handsets
• SRT Group License CEVA Signal Processing IP
• STEPMIND Licenses CEVA-Palm DSP Core for Cellular Handsets
• STMicroelectronics Demonstrates One of the Industry’s Lowest Power and Most Robust Bluetooth™ Radio Co-Developed with Parthus
• Sunplus Achieves Volume Shipments of New Home Entertainment SoCs powered by the CEVA-TeakLite-III Audio DSP
• Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices
• Sunplus mMedia Licenses CEVA’s MM2000 Multimedia Solution for Portable Multimedia Processors
• Synopsys and CEVA Deliver Superior Performance, Power and Area for CEVA DSP Cores with DesignWare HPC Design Kit
• Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds
• The Israeli Short Range Communication Consortium (“ISRC”) Demonstrates Next-Generation Communications Technologies
• Tower Semiconductor Ltd., a leading Semiconductor specialized foundry in Israel, and DSP Group, Inc. the leader in the development and licensing of high-performance, low-power, digital-signal-processor (DSP) cores, today announced that Tower Semiconduct
• TransChip and CEVA Collaborate to Create Highly Compact Video Streaming Solution for Multimedia Applications
• Trident Microsystems Licenses CEVA’s DSP for Set-Top Box and DTV Product Lines
• US Department of Defense Contracts with ParthusCeva for NavStream™ 3000 GPS Location Technology
• VATICS Chooses CEVA Imaging and Vision DSP for its Surveillance and Smart Camera SoCs
• VIA Telecom Licenses ParthusCeva TeakLite DSP Core to Power Next Generation 2.5G and 3G Wireless Modems
• Virage Logic’s ASAP Memory Solidifies Place in the SoC Ecosystem with Incorporation into CEVA DSP Platform
• VMTS and CEVA Partner for Development of Next-Generation Mobile Solutions
• Wacom, STMicroelectronics, and CEVA Collaborate to Enhance the Digital Pen Experience
• Waves Audio and CEVA Partner for Far-Field Voice Pick Up and Psychoacoustic Sound Enhancement Solutions targeting Mobile, Smart Home and Wireless Audio Markets
• Waves Partners with CEVA to Offer the latest Sonic Enhancement Technologies for the Mobile Market
• Winner Micro Licenses CEVA’s Bluetooth and Wi-Fi IP Platforms for IoT Connectivity SoC
• Wireless Design Conference names Parthus Technologies director Michael McCullagh as Conference Chair
• WiSig Networks License CEVA’s Cellular IoT Technology to Serve the India Market
• Xincomm Selects CEVA DSP Core for LTE Baseband Chipsets
• XStreamHD™ Licenses and Deploys CEVA Enterprise SATA IP in XStreamHD HD Media Server
• Yamaha Selects CEVA-TeakLite-4 Audio/Voice DSP
• Zoran Licenses And Deploys CEVA-TeakLite DSP Core To Power DVD Chipset Solution
• ZTE Corporation Licenses CEVA-XC DSP for LTE TDD/FDD Base Station and Network Infrastructure
• µ-blox Licenses Parthus Global Positioning System (GPS) Technology for Deployment in Next Generation Mobile Internet Devices

Events

• 10th Annual Credit Suisse Semiconductor Supply Chain Conference
• 10th Annual ROTH Technology Event
• 2022 RT-Thread IoT OS Global Tech Conference
• 20th Annual Needham Growth Conference
• 23rd Annual Needham Virtual Growth Conference
• 25th Annual Needham Growth Conference
• 26th Annual Needham Growth Conference
• 30th Annual ROTH Conference
• 31st Annual ROTH Conference
• 33rd Annual Roth Conference
• 35th Annual Roth Conference
• 36th Annual ROTH Conference
• 37th Annual Canaccord Genuity Growth Conference
• 5G World
• 5G World 2018
• 5th Annual Virtual National Nasdaq Investor Relations Forum
• 5th Annual Wells Fargo TMT Summit
• ARM TechCon 2017
• Augmented World Expo 2022
• AUTOSENS 2019
• Autosens 2020 Brussels Edition
• AUTOSENS Brussels
• AutoSens Brussels 2017
• AutoSens Brussels 2021
• AutoSens Detroit 2017
• Autosens Detroit 2019
• AutoSense Brussels 2023
• AWE USA 2017
• AWE USA 2021
• B. Riley 2017 Institutional Investors Conference
• Baird 2021 Global Consumer, Technology & Services Conference
• Barclays Global Technology, Media and Telecommunications Conference
• Barclays Global Technology, Media and Telecommunications Conference
• Barclays Global Technology, Media and Telecommunications Conference
• Barclays Global TMT Conference
• Barclays Global TMT Conference
• Benchmark Company One on One Conference
• Benchmark Discovery One-on-One Conference
• Bluetooth Asia 2017
• Bluetooth Asia 2018
• Bluetooth Asia 2019
• Bluetooth World
• Canaccord Genuity 38th Annual Growth Conference
• Canaccord Genuity 40th Annual Growth Conference
• CES 2018
• CES 2019
• CES 2020
• CES 2021
• CES 2022
• CES 2023
• CES 2024
• CEVA First Quarter 2020 Earnings Conference Call
• CEVA First Quarter 2021 Earnings Conference Call
• CEVA Fourth Quarter and Full Year 2020 Earnings Conference Call
• CEVA Fourth Quarter and Full Year 2021 Earnings Conference Call
• CEVA Fourth Quarter and Year End 2019 Earnings Conference Call
• CEVA Investor and Analyst Day
• CEVA Investor Day 2023
• CEVA Q1 2019 Earnings Conference Call
• CEVA Q2 2018 Earnings Conference Call
• CEVA Q2 Earnings Conference Call – Replay:
• CEVA Q3 2018 Earnings Conference Call
• CEVA Q3 Earnings Conference Call
• CEVA Q4 and Full Year 2017 Earnings Conference Call
• CEVA Q4 and Full Year 2018 Earnings Conference Call Replay
• CEVA Second Quarter 2019 Earnings Conference Call
• CEVA Second Quarter 2021 Earnings Conference Call
• CEVA Technology Symposium – Beijing
• CEVA Technology Symposium – Hsinchu
• CEVA Technology Symposium – Hsinchu
• CEVA Technology Symposium – Shanghai
• CEVA Technology Symposium – Shanghai
• CEVA Technology Symposium – Shenzhen
• CEVA Technology Symposium – Shenzhen
• CEVA Technology Symposium – Tokyo
• CEVA Technology Symposium 2017- Hsinchu
• CEVA Technology Symposium 2017- Shanghai
• CEVA Technology Symposium 2017- Shenzhen
• CEVA Technology Virtual Seminar 2020 – Spring Edition – AI and Vision
• CEVA Technology Virtual Seminar 2020 – Spring Edition – Communication
• CEVA Technology Virtual Seminar 2020 – Spring Edition – Connectivity and Sensing
• CEVA Technology Virtual Seminar 2020 – Spring Edition – Wireless Audio
• CEVA Third Quarter 2019 Earnings Conference Call
• CEVA Third Quarter 2020 Earnings Conference Call
• CEVA Third Quarter 2021 Earnings Conference Call
• CEVA’s Virtual MWC 2020 booth
• CEVA, Inc. Annual Stockholders Meeting
• CEVA, Inc. Q1 2018 Earnings Conference Call
• CEVA, Inc. Virtual Annual Shareholder Meeting
• CEVA, inc. Virtual Stockholder Meeting
• ChipEx
• Chipex 2017
• Chipex 2019
• CHIPEX 2021
• ChipEx 2022
• ChipEx 2024
• ChipEx2018
• CISA-ICCAD 2022
• Citi 2018 Global Technology Conference
• Citi 2019 Global Technology Conference
• Citi Global Technology Conference
• Citi’s 2020 Global Technology Virtual Conference
• Computex
• Cost Effective 5G for the IoT: From CAT-1 to Reduced Capability 5G
• Cowen 2020 Virtual TMT Conference
• Cowen 46th Annual Technology, Media & Telecom Conference
• Cowen 47th Annual Technology, Media & Telecom (TMT) Conference
• Cowen 49th Annual Technology, Media & Telecom Conference
• Cowen’s 50th annual TMT Conference
• CSIA-ICCAD 2017 Annual Conference
• CSIA-ICCAD 2019 Annual Conference
• CSIA-ICCAD 2021
• CSIA-ICCAD 2023
• CVPR 2018
• CVPR 2019
• CVPR 2020
• D&R IP-SoC 20 Conference – Worldwide
• D&R IP-SoC Day 2020 China
• Design Solution Forum 2017
• Design Solution Forum 2019
• Design Solution Forum 2021
• Design Solution Forum 2021
• Design Solution Forum 2023
• Deutsche Bank Technology Conference
• Deutsche Bank Technology Conference
• Dougherty & Company 2018 Institutional Investor Conference
• Dougherty & Company Institutional Investor Conference
• Drexel Hamilton TMT Conference
• Edge AI Summit 2022
• Embedded Vision Summit (EVS)
• Embedded Vision Summit 2017
• Embedded Vision Summit 2018
• Embedded Vision Summit 2020
• Embedded Vision Summit 2021
• Embedded Vision Summit 2022
• Embedded Vision Summit 2023
• Embedded Vision Summit 2024
• Embedded World 2019
• Embedded World 2023
• Embedded World 2024
• Exane BNP Paribas 14th Mid Cap Forum
• First Quarter 2022 Earnings Release and Conference Call
• First Quarter 2023 Earnings Release and Conference Call
• Fourth Quarter and Full Year 2022 Earnings Release and Conference Call
• Fourth Quarter and Full Year 2023 Earnings Release and Conference Call
• GF Technology Summit (GTS) 2022
• Global Autonomous Driving Innovation Summit 2018
• GOMACTech
• GOMACTech 2022 Conference
• GSA European Executive Forum
• GSA US Executive Forum
• Hot Chips 2023
• Hot Chips HC31
• HOTCHIPS (HC30)
• Hotchips HC29
• ICCAD 2018
• ICCAD 2020
• IESA Vision Summit
• Image Sensors Americas 2017
• Image Sensors Auto US 2017
• IMVC 2018
• IMVC 2019
• Intel Foundry Services Direct Connect 2024
• IoT/CPS & Security Symposium
• IP-SoC Conference & Exhibition
• IS Image Sensors Automotive 2017
• ISC West 2019
• IWPC Webinar Wednesday’s 2020
• Jefferies 2019 Semiconductor, Hardware and Communications Infrastructure Summit
• Jefferies 2021 Semiconductor, IT Hardware and Communications
• Jefferies 2022 Semiconductor, IT Hardware and Communications Infrastructure Summit
• Jefferies Israel Tech Trek
• Jefferies Israel Tech Trek
• Jefferies Israel Tech Trek & Conference
• Jefferies Israel Tech Trek 5.0
• Jefferies Semiconductor, IT Hardware & Communications Technology Summit
• Jefferies Technology Group Investor Conference
• Jefferies Virtual Semiconductor, IT Hardware & Communications Infrastructure Summit
• Linley Autonomous HW Conference
• Linley Fall Processor Conference
• Linley Fall Processor Conference 2018
• Linley Fall Processor Conference 2019
• Linley Fall Processor Conference 2020
• Linley Fall Processor Conference 2021
• Linley IoT Hardware Conference 2017
• Linley Processor Conference 2017
• Linley Spring Processor Conference
• Linley Spring Processor Conference 2018
• Linley Spring Processor Conference 2020
• Linley Spring Processor Conference 2021
• Linley Spring Processor Conference 2022
• Live Webinar: 5G NR base-stations redefine the SDR paradigm
• Live Webinar: Enabling mass market ADAS applications using real-time vision systems
• LIVE Webinar: Hassle-free Bluetooth 5 SoC design
• Live webinar: Turnkey solution for Bluetooth true wireless stereo earbuds and speakers
• Loop Capital Markets 5th Annual Investor Conference
• Micro-Electronics Seminar 2024
• Mizuho Americas Israel Growth Conference 2024
• Mizuho Technology Conference 2024
• Mobile World Congress – Shanghai 2018
• Mobile World Congress 2017
• Mobile World Congress 2018
• Mobile World Congress Shanghai 2017
• Mobile World Congress Shanghai 2021
• MWC 2019
• MWC 2023
• MWC 2024
• MWC Shanghai
• MWC Shanghai
• MWC Shanghai 2019
• Needham Growth Conference
• Needham Growth Conference
• Needham Virtual Technology & Media Conference
• On-demand webinar: 3D Audio technology and emerging applications for immersive listening experience
• On-demand webinar: Enhancing the TWS User Experience with Sensor Fusion
• Online webinar: 5G Innovation: 5G OpenRAN Overview & Implications
• Oppenheimer 19th Annual Israeli Conference
• Oppenheimer 20th Annual Technology, Internet & Communications Conference
• Oppenheimer 21st Annual Technology, Internet & Communications Conference
• Oppenheimer 24th Annual Technology, Internet & Communications Conference
• Oppenheimer 25th Annual Technology, Internet & Communications Conference
• Oppenheimer 26th Annual Technology, Internet & Communications Conference
• Oppenheimer 27th Annual Technology, Internet & Communications Conference
• Oppenheimer 4th Annual 5G Summit: The Revolution Continues 2023
• Oppenheimer 5G Summit
• Oppenheimer Annual Israeli Conference
• Oppenheimer’s 22nd Annual Israeli Conference
• Oppenheimer’s 23rd Annual Technology, Internet & Communications Conference
• Q1 2017 Earnings Conference Call – Replay
• Rosenblatt Securities Technology Summit – The Age of AI Scaling
• Rosenblatt Securities’ Technology Summit – The Age of AI Scaling
• Rosenblatt Securities’ Technology Summit – The Age of AI Scaling
• Rosenblatt’s 3rd Annual Technology Summit: The Age of AI
• ROTH Capital Conference
• ROTH Internet of Things Corporate Access Day
• ROTH London Conference
• ROTH Technology Corporate Access Day
• Roth Technology Virtual Event
• ROTH Virtual London Conference
• Samsung Advanced Foundry Ecosystem Forum 2023
• Samsung Advanced Foundry Ecosystem Forum 2023 – Korea
• Second Quarter 2022 Earnings Release and Conference Call
• Second Quarter 2023 Earnings Release and Conference Call
• SemIsrael Expo 2017
• SemIsrael Technology Week 2018
• Sensor Converge 2024
• Sensors Converge 2022
• Sensors Converge 2023
• Sensors Expo & Conference 2020
• SiFive Tech Symposium- Israel
• SMIC Technology Symposium Shanghai
• SMIC Technology Workshop 2017
• Spatial Audio Webinar
• ST Developers Conference & Technology Tour 2019
• ST Developers Conference 2022
• Stifel 2018 Cross Sector Insight Conference
• Stifel 2019 Cross Sector Insight Conference
• Susquehanna 10th Annual Technology Conference
• Susquehanna Seventh Annual Technology Conference
• Susquehanna Technology Conference
• Third Quarter 2022 Earnings Release and Conference Call
• Third Quarter 2023 Earnings Release and Conference Call
• TinyMl Summit
• tinyML Summit 2022
• TinyML Summit 2024
• TSMC 2018 OIP Ecosystem Forum and Technology Symposium Europe
• TSMC 2019 China Symposium
• TSMC 2019 Europe
• TSMC 2019 Japan Symposium
• TSMC 2019 Taiwan Symposium
• TSMC 2021 Online Technology Symposium
• TSMC 2022 EU Technology Symposium – Israel
• TSMC 2023 -Taiwan Technology Symposium
• TSMC 2023 China Technology Symposium
• TSMC China Technology Symposium 2024
• TSMC OIP Ecosystem Forum 2017
• TSMC Symposium Japan
• TSMC Symposium Japan 2018
• TSMC Symposium online
• TSMC Taiwan Technology Symposium
• TSMC Taiwan Technology Symposium 2024
• TSMC Tech Symposium 2018 – Hsinchu
• TSMC Tech Symposium 2018 – Shanghai
• TSMC Technology Symposium Japan 2017
• TSMC Technology Symposium Japan 2023
• TSMC Technology Symposium Japan 2024
• Webinar: Cost Effective 5G For The IoT
• Webinar: Custom SoCs for Narrowband IoT (NB-IoT)
• Webinar: Driving Forward with UWB Radar
• Webinar: Spot-On Dead Reckoning for Indoor Autonomous Robots
• Webinar: Voice interfaces of the future
• Wells Fargo 6th annual TMT Summit
• Wells Fargo 7th Annual TMT Summit
• Wells Fargo TMT Conference