Silicon Laboratories Deploys CEVA-Teak DSP Core in Industry's Most Highly-Integrated Single-Chip Phone for GSM/GPRS Handsets

SAN JOSE, Calif. - November 1, 2005 - CEVA Inc., (NASDAQ: CEVA;
LSE: CVA), the leading licensor of digital signal processors (DSP) cores,
multimedia, GPS and storage platforms to the semiconductor industry
announced today that Silicon Laboratories' has licensed and deployed the
CEVA-Teak DSP core in the AeroFONE™ single-chip phone, the industry's most
integrated, highest performance, easiest-to-use solution for GSM/GPRS
handsets.

Existing cellphone IC solutions in the industry integrate some of the
standard components that comprise the functionality of a handset,
including digital baseband, RF transceiver, logic and analog functions.
However, Silicon Laboratories' breakthrough innovations in chip design and
integration has enabled them to take this process one step further,
without compromising performance. By additionally integrating the analog
baseband, power management unit (PMU), battery interface and charging
circuitry into their single-chip phone, Silicon Laboratories has achieved
a level of integration that no other solution in the market today can
match.

Leveraging the superior processing performance and low-power
requirements of CEVA-Teak to perform the baseband processing, AeroFONE
offers a flexible and scalable platform for entry-level GSM/GPRS handsets
without using expensive additional co-processors. The high performance of
the AeroFONE single-chip phone also allows handset manufacturers to easily
meet the stringent performance requirements of cellular network operators
worldwide.

"The entry-level handset chip market is one of the most
highly-competitive and high-volume markets in the industry," said Dan
Rabinovitsj, vice president of Silicon Laboratories. "To achieve market
penetration requires a solution which delivers exceptional performance
with minimal power consumption and at a lowest possible total
bill-of-materials. In the AeroFONE™ single-chip phone, the CEVA-Teak's
low-power and high-performance baseband processing capabilities
facilitated the successful inception of this product."

"The combination of CEVA's proven expertise in delivering
high-performance, industry-leading DSP cores along with Silicon
Laboratories' excellent track record in developing leading-edge handset
technologies like AeroFONE, resulted in the creation of a truly unique
offering for the handset market," said Gideon Wertheizer, CEO of CEVA.
"This latest deployment of our CEVA-Teak DSP core further demonstrates the
continued adoption of CEVA's technologies by leading semiconductor
companies and underlines our position as the industry's leading licensor
of DSP cores for wireless communications."

CEVA-Teak is a 16-bit fixed-point general-purpose DSP core. Its dual
MAC architecture features high-performance, high flexibility and
throughput for complex Digital Signal Processing implementations. The core
is designed for low-power, speech and audio processing, multimedia and
wireless communications (GSM, CDMA, EDGE, 3G, etc.), high-speed modems,
advanced telecommunication systems, and various embedded control
applications. CEVA-Teak is designed with consideration for low-power uses
to achieve the best possible performance with the lowest possible power
consumption. It makes the core suitable to a wide variety of
battery-powered portable applications.

About AeroFONE™

The AeroFONE single-chip phone addresses the increasingly competitive
handset market where board space is at a premium and total
bill-of-materials (BOM) must enable a low cost handset without sacrificing
performance.

  • The AeroFONE single-chip phone supports the industry drive for high
    performance entry-level handsets.

  • The AeroFONE single-chip phone does not compromise on RF performance
    and exhibits the same industry-leading sensitivity, blocking and
    transmit modulation spectrum characteristics of the Aero® II
    transceiver, all key requirements for entry-level handsets. Because
    newer deployments of network infrastructure in developing regions lack
    wide coverage, dropped calls are common if handsets do not have good
    sensitivity. Furthermore, high quality and reliability are important in
    emerging markets where new users will pay as much as one month's salary
    for a mobile phone. Return rates must be kept low in such markets as
    after-sales service is difficult and costly to implement for operators.

  • Silicon Laboratories' approach to the single-chip phone offers a
    flexible and scalable platform for entry-level GSM/GPRS handsets without
    using expensive additional co-processors. Advanced multimedia
    capabilities can be supported with hardware co-processors allowing
    handset differentiation while saving costs.

  • Silicon Laboratories' flexible software architecture uniquely
    enables handset developers to choose the software solution best for
    them.

  • For more information visit www.silabs.com/AeroFONE

About CEVA, Inc.

Headquartered in San Jose, Calif., CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including multimedia, audio, Voice over Packet (VoP), GPS location, Bluetooth, Serial Attached SCSI and Serial ATA (SATA). In 2005 CEVA's IP was shipped in over 115 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information, visit www.ceva-dsp.com.

A PDF copy of this press release is also available here

Silicon Laboratories, AeroFONE and Aero are trademarks of
Silicon Laboratories Inc. All other product names noted herein are
trademarks of CEVA, Inc.