San Jose, Calif - September 15, 2003 - ParthusCeva, Inc.
(Nasdaq: PCVA, LSE: PCV) the leading licensor Digital Signal Processor
(DSP) cores and solutions to the semiconductor industry, today announced
that Renesas Technology Corp., the world's number one supplier of
microcontrollers and the third largest semiconductor company in the world,
has licensed ParthusCeva's TeakLite® DSP Core. Renesas has commenced
shipping GSM / GPRS semiconductor chips powered by ParthusCeva's TeakLite
DSP to customers manufacturing next generation handset products. Renesas
was formed in April 2003 by the integration of Hitachi and Mitsubishi
Electric semiconductor operations.
TeakLite DSP core is optimized for modem devices requiring advanced
functionality, and audio processing combined with low-power consumption.
The core enables the development of low power handset modems and is an
excellent solution for the modem functionality, low-power speech and audio
processing required by mobile and communication devices.
"With next generation applications expanding all the time,
ParthusCeva's TeakLite offers a superb low-power and high-performance DSP
core platform for chipsets that will continue to meet growing market
requirements in the future," commented Mr.Shinji Suda, Department manager,
SOC department of Renesas Technology. "GSM / GPRS chipset development was
completed on time and in budget and is a testament to our teams abilities
to leverage TeakLite's core to build on for the future."
"With Renesas, the third largest semiconductor in the world, licensing
our TeakLite DSP core is further endorsement of our position as the number
one licensed DSP architecture in the industry," said Chet Silvestri, CEO
of ParthusCeva. "Powered by our TeakLite DSP core, Renesas has produced a
wireless solution that leads the industry in performance,
power-consumption and feature set and has already been adopted by leading
European manufacturers of handsets."
TeakLite is a 16-bit fixed-point general-purpose licensable DSP core.
Designed for low power and high-performance applications such as cellular
handsets, MP3 players, disk drive controllers, cordless, VoIP terminals
and various embedded control applications. TeakLite, a fully synthesizable
soft core, is a process independent core that is easily portable to any
TeakLite is a member of ParthusCeva's SmartCores™ family. These
low-power, fixed-point licensable DSP cores offer a range of performance,
price and power consumption balances, addressing a wide range of
applications, from low-end, high-volume applications, such as digital
answering machines, hard disk controllers, low speed modems and Voice over
IP terminals, to high performance applications such as third generation
(3G) cellular communications, broadband modems, consumer multimedia and
Voice over IP gateways. A comprehensive portfolio of software and hardware
development tools supports the SmartCores family. In addition, a large
network of third party companies offers applications, tools and design
SmartCores licensees benefit from the advanced architecture features,
Fully synthesizable soft core that can be ported to any
process or foundry
compatible allowing re-use of legacy code and significantly shorter time
consumption -- High code density - to reduce chip cost
Cores offered at various performance levels - beginning with single-MAC
(OakDSPCore® and TeakLite®) architecture to Dual-MAC (Teak®), Dual-MAC
with Instruction Level Parallelism (PalmDSPCore®) and the scalable,
multiple MAC and extendible architecture of CedarDSPCore.
About Renesas Technology Corp.
Renesas Technology Corp. designs and manufactures highly integrated
semiconductor system solutions for mobile, networking, automotive,
industrial and digital home electronics markets. Established on April 1,
2003 as a joint venture between Hitachi, Ltd. and Mitsubishi Electric
Corporation and headquartered in Tokyo, Japan, Renesas Technology is one
of the largest semiconductor companies in the world and world leading
microcontroller supplier globally. Besides microcontrollers, Renesas
Technology offers system-on-chip devices, Smart Card ICs, mixed-signal
products, flash memories, SRAMs and more. http://www.renesas.com/
About ParthusCeva, Inc.
Further information about ParthusCeva
A PDF copy of this press release is also available here
OakDSPCore, PalmDSPCore, Teak, TeakLite, CedarDSPCore and
SmartCores are trademarks and registered trademarks of ParthusCeva, Inc.
All other trademarks are the property of their respective owner.
ParthusCeva Safe Harbor Statement
This document contains "forward-looking statements", which
are subject to certain risks and uncertainties that could cause actual
results to differ materially from those stated. Any statements that are
not statements of historical fact (including, without limitation,
statements to the effect that the company or its management "believes,"
"expects," "anticipates," "plans" and similar expressions) should be
considered forward-looking statements. Important factors that could cause
actual results to differ from those indicated by such forward-looking
statements include uncertainties relating to the ability of management to
successfully integrate the operations of Parthus and Ceva, uncertainties
relating to the acceptance of our DSP cores and semiconductor intellectual
property offerings, continuing or worsening weakness in our markets and
those of our customers, quarterly variations in our results, and other
uncertainties that are discussed in the registration statement on Form
S-1and the most recent quarterly report on Form 10-Q of ParthusCeva
(formerly called Ceva, Inc.), on file with the U.S. Securities and