San Jose, Calif - July 22, 2003 - ParthusCeva, Inc. (Nasdaq:
PCVA, LSE: PCV) the leading provider of licensable Digital Signal
Processor (DSP) cores and platform-level IP to the semiconductor industry,
today announced that STMicroelectronics (NYSE: STM), a leading
semiconductor manufacturer, has licensed ParthusCeva's TeakLite® DSP core
to power selected Digital Subscriber Line (DSL) chipset solutions.

DSL enables communications over existing telephone wires at over 100
times faster speeds than conventional voice modems. ParthusCeva's
TeakLite® DSP core powers ST's Multi-channel ADSL (Asymmetrical Digital
Subscriber Line) and SHDSL (Symmetrical High-bit rate Digital Subscriber
Line) chipsets.

"Through the recent acquisition of Tioga Technologies ST has added
these multi-channel ADSL and SHDSL chipsets to the company's DSL
portfolio, complementing an already comprehensive range extending from
ADSL to VDSL", said Andy Carmon, STMicroelectronics' DSL products
Engineering Director. "Through this license agreement for the DSP cores
used in these chipsets we have now completed this transfer."

"We are pleased to extend our long-standing partnership with
STMicroelectronics with this new DSP licensing agreement," said Gideon
Wertheizer, Executive Vice President and CTO of ParthusCeva. "DSL is one
of the fastest growing technologies in the communications industry and
this new licensing agreement with ST underlines our number one position in
the open licensable DSP market".

About TeakLite®

TeakLite®, the third generation of the SmartCores™ family, is a 16-bit
fixed-point, general-purpose DSP core designed for low power, low voltage
and high-speed digital processing applications. The core is designed as a
solution for modems, advanced telecommunication systems, speech and audio
processing, wireless communication, disk-drive controllers and embedded
control applications. The binary code compatibility of the TeakLite® DSP
core with ParthusCeva's OakDSPCore® effectively eliminates the need to
recompile or rewrite existing software modules during migration to the
TeakDSPCore® family. The fully synthesizable, process-independent
TeakLite® is easily portable to any Application Specific Integrated
Circuit (ASIC) library. The core can be used as an engine for
DSP-based-ASICs and ASSPs, and is available as a DSP core in a
standard-cell library applicable for custom chip design.

About ParthusCeva, Inc.

Further information about ParthusCeva

A PDF copy of this press release is also available here

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ParthusCeva Safe Harbor Statement

Various statements in this press release concerning
ParthusCeva's future expectations, plans and prospects are
"forward-looking statements", which are subject to certain risks and
uncertainties that could cause actual results to differ materially from
those stated. Any statements that are not statements of historical fact
(including, without limitation, statements to the effect that the company
or its management "believes", "expects", "anticipates", "plans" and
similar expressions) should be considered forward-looking statements.
These statements are subject to a number of risks and uncertainties that
could cause actual results to differ materially from those described,
including the following:

• the industries in which we license our
  technology are experiencing a challenging period of slow growth that has
  negatively impacted and could continue to negatively impact our business
  and operating results;

• the markets in which we operate are highly
  competitive, and as a result we could experience a loss of sales, lower
  prices and lower revenue;

• our operating results fluctuate from quarter to
  quarter due to a variety of factors including our lengthy sales cycle,
  and are not a meaningful indicator for future performance

• we rely significantly on revenue derived from a
  limited number of licensees; and

• other risks discussed in "Management's
  Discussion and Analysis of Financial Condition and Results of
  Operations--Factors that Could Affect Our Operating Results," in our
  quarterly report on Form 10-Q for the first quarter of 2003, filed with
  the U.S. Securities and Exchange Commission on May 14, 2003.