SAN JOSE, Calif. - September 15, 2004 - CEVA, Inc. (NASDAQ:
CEVA, LSE: CVA) the leading licensor of Digital Signal Processor (DSP)
cores and communications solutions to the semiconductor industry, today
announced that Japan Radio Co., Ltd. (TSE: 6751), a leading manufacturer
of electronic professional communication equipment, has licensed the
CEVA-Teak™ DSP core to power their baseband radio communication solutions.
Japan Radio Co., Ltd. (JRC) is embedding CEVA-Teak DSP Core in a baseband
chip for it's communications equipment to deliver complete signal
CEVA-Teak's core and architecture facilitates JRC's capabilities to
easily create low-power consumption, high-performance DSP sub-systems. By
deploying CEVA-Teak in it's System-on-Chip (SoC) solution, JRC is able to
design and build an efficient solution for a market that requires high
speed applications with absolute consistency over wide distances. The DSP
sub-system communicates via a multi-layered bus, is coupled with a JRC
proprietary DMA and is integrated with a RISC sub-system from a CPU.
"The importance of incorporating a market proven DSP core and the ease
of integration into our SoC was critical in providing the right solution
for this project," said Keiichi Nonaka, general manager of Mobile
Communications R&D of JRC. "JRC is committed to high performance
solutions and we are glad to have CEVA become a part of our team."
"Working together with JRC, a leading producer of electronic platforms,
extends the range of markets that exploit CEVA DSP cores for baseband
applications," commented Gideon Wertheizer, EVP and CTO of CEVA. "DSP
technology is fundamental in the growth of next-generation radio
communications platforms and JRC's DSP core chipset underlines the
advantages in creating an architecture for system-on-chip solutions with
CEVA DSP cores."
CEVA-Teak is a 16-bit fixed-point general-purpose DSP core. Its dual
MAC architecture features high-performance, high flexibility and
throughput for complex Digital Signal Processing implementations. The core
is designed for low-power, speech and audio processing, multimedia and
wireless communications (GSM, CDMA, EDGE, GPRS, 3G, etc.), high-speed
modems, advanced telecommunication systems, and various embedded control
applications. CEVA-Teak is designed with consideration for low-power
consumption to achieve the best possible performance with the lowest
possible power consumption. It makes the core suitable to a wide variety
of battery-powered portable applications.
CEVA and CEVA-Teak are registered trademarks CEVA, Inc.
Other brands and products referenced herein are the trademarks or
registered trademarks of their respective holders.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including multimedia, audio, Voice over Packet (VoP), GPS location, Bluetooth, Serial Attached SCSI and Serial ATA (SATA). In 2005 CEVA's IP was shipped in over 115 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information, visit www.ceva-dsp.com.
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