SAN JOSE, Calif., Oct. 9 /PRNewswire-FirstCall/ -- Fueled by an industry shift to open, licensable signal processing solutions for wireless applications, CEVA, Inc. (NASDAQ: CEVA)(LSE: CVA) is emerging as a leader in licensing DSP cores to the world's leading Wireless Handset IC Suppliers and OEMs. This emerging trend is evidenced by today's announcement that NXP has licensed the CEVA-Teak™ DSP core for its ultra-low-cost cellular solutions.
NXP is the latest world-class semiconductor company to announce the adoption of CEVA DSP technology as the DSP architecture of choice for handset designs, joining a high-profile customer list, including Broadcom, Chipnuts, EoNex, Infineon, InterDigital, Renesas, ROHM, Sharp, Spreadtrum and VIA, as well as yet-to-be-announced major European and Taiwanese chipset suppliers. Quantifying CEVA's strong momentum in DSP, research firm Gartner reports CEVA's share of the worldwide market in 2006 at 53 percent based on design IP Revenue(1).
Baseband and multimedia solutions utilizing open DSP architectures, such as CEVA-TeakLite, CEVA-Teak and CEVA-X, are increasingly favored by handset manufacturers. Today, CEVA's DSP cores are shipping in wireless solutions deployed by many of the world's leading handset manufacturers, including Nokia, Samsung, Sony Ericsson, LG Electronics, Sharp, Lenovo, Panasonic, Palm, Arima, BenQ, ZTE, TCL, Amoi, Haier, Hisense, Ningbo Bird and CECT.
Will Strauss, president of Forward Concepts, commented, "The recent design wins for Broadcom and Infineon at Nokia with platforms incorporating CEVA DSPs, along with NXP's win at Samsung, are strong endorsements for CEVA's DSP technology by the handset industry's largest players. This, together with the success of other CEVA customers, including China's Spreadtrum Communications and a European 3G baseband chipset supplier, clearly support the strategy of adopting third-party, open DSP cores from CEVA for cellular baseband development. With its strong customer base, CEVA is well positioned to exploit the projected growth in the wireless handset industry."
Gideon Wertheizer, CEO of CEVA, stated, "Driven by the handset manufacturers, the wireless industry is undergoing a fundamental shift away from proprietary DSP architectures toward open DSP architectures like the CEVA DSP cores. This enables the handset manufacturers to reduce their chipset costs by sourcing their chips from multiple vendors using a common DSP architecture. By providing industry-leading DSP technology and a comprehensive roadmap to enable the baseband suppliers to develop solutions for ultra-low-cost handsets, multimode 2.5G/3G, as well as 4G baseband solutions, CEVA is ideally situated to build on its strong position within the handset industry."
According to research firm Forward Concepts, the mobile handset market is set to grow to 1.5 billion units by 2011, up from 1.03 billion units in 2006. To address this growing market, CEVA offers a comprehensive portfolio of DSPs tailored for every baseband application ranging from ultra-low-power DSP cores to high-performance Quad MAC and 32bit DSPs. In addition, CEVA offers a range of software IP that can run on the integrated baseband CEVA DSP, thereby allowing the baseband suppliers to create compelling, differentiated baseband/application processor solutions with multimedia, Bluetooth or audio features for the handset manufacturers.
For more information on CEVA's DSP cores or to see a range of handsets powered by CEVA DSP cores, visit the CEVA website at https://www.ceva-dsp.com/.
This press release contains forward-looking statements and assumptions that if they prove incorrect could cause CEVA's financial results to differ materially from those expressed or implied by such forward-looking statements and assumptions. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including statements about CEVA's emergence as a leader in licensing DSP cores, the industry shift to open, licensable DSP architectures, the benefits of such open architectures and CEVA's ability to benefit from such a shift, CEVA's strong momentum in DSP, CEVA being ideally situated to build on its strong position within the handset industry and the growth of the mobile handset market. The risks and uncertainties include: the failure of the industry shift to open architectures to materialize, failure of CEVA to capitalize on the market opportunities associated with this industry shift, failure of the mobile handset market to grow as anticipated or as quickly as anticipated, CEVA's failure to compete effectively with other licensors of open architectures and other risks described from time to time in CEVA's Securities and Exchange Commission filings. CEVA assumes no obligation to update any forward-looking statements or assumptions, which speak as of their respective dates.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices.
For more information, visit https://www.ceva-dsp.com/. (1) Source: Gartner, Inc., "Market Share: Semiconductor Intellectual Property, Worldwide, 2006" Christian Heidarson, 20 June 2007
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SOURCE: CEVA, Inc.
Web site: https://www.ceva-dsp.com/