MOUNTAIN VIEW, Calif., March 24, 2011 /PRNewswire/ -- CEVA, Inc. (Nasdaq: CEVA; LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that the CEVA-XC323™ communications processor, has been voted 2010 Product of the Year by Electronic Products China (EPC).
Addressing next-generation 4G terminal and infrastructure markets, the CEVA-XC323 has been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance Software Defined Radio multimode solutions. It supports multiple air interfaces in software, including LTE-A, LTE, TD-LTE, WiMAX 16m, HSPA+, HSPA, TD-SCDMA, GSM and CDMA.
The CEVA-XC323 architecture is scalable to address the complete range of wireless baseband designs, from handsets and smartphones, through tablets and datacards, to femtocells, picocells and macrocells. More information on the CEVA-XC323 is available at http://www.ceva-dsp.com/products/cores/ceva-xc323.php
"It is an honor that the CEVA-XC323 has been recognized by the EPC judging panel," said Eran Briman, Vice President of Marketing at CEVA. "This prestigious Product of the Year award validates the significant benefits that the CEVA-XC323 brings to our customers in China and around the world. With the CEVA-XC323 they can apply software defined radio technologies to improve performance, flexibility and time-to-market for their LTE multimode processor designs."
CEVA dominates the DSP licensing market with a 78% market share^ and is the world's #1 deployed DSP architecture in cellular baseband processing, powering 36% of all baseband processors shipped in Q3 2010^^. With seven of the world's top eight handset OEMs shipping CEVA-powered baseband processors today, CEVA's DSP technology now powers one out of every three handsets worldwide.
Overall, CEVA has more than thirty five wireless customers powering 2G, 3G and 4G solutions, including twelve LTE design wins to date. CEVA DSPs have already shipped in more than 1 billion cellular baseband processors, including the world's first commercially deployed LTE chipsets from Samsung. CEVA's market leadership is set to continue to grow as the wireless industry shifts more designs to CEVA-powered wireless semiconductor customers, including Broadcom, Intel, Samsung, Spreadtrum, ST-Ericsson and VIA Telecom.
More information on CEVA's industry-leading DSP cores is available at http://www.ceva-dsp.com/products/cores/index.php.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
^ Source: The Linley Group "Mobile and Wireless Semiconductor Market Share 2009" by Joseph Byrne, Linley Gwennap, and Jag Bolaria, June 2010.
^^ Source: Strategy Analytics – Baseband Market Share Tracker, December 2010, CEVA internal data.
SOURCE CEVA, Inc.