SAN JOSE, Calif., July 31 /PRNewswire-FirstCall/ -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), today announced it will host a Technology Symposium for the embedded engineering community in Shanghai, China, August 14, 2007, at the Sofitel Jing Jiang Oriental Pudong Hotel. The full-day event will provide attendees with technical insight into CEVA's latest technologies, solutions and methodologies used to develop highly differentiated and competitive System-on-Chips (SoCs) deployed by many of the world's leading semiconductor companies and OEMs.
The Symposium's agenda will feature a range of sessions delivered by CEVA staff, covering aspects of differentiated SoC designs for various applications, including portable multimedia players, HD audio devices, VoIP phones and Mobile TV handsets. At the Symposium CEVA will discuss processor selection criteria, efficient application development techniques and practices for effective DSP integration. In addition, a number of partners will present and demonstrate their solutions for further enhancement of CEVA's offerings and designing competitive SoCs.
Attendees will also have the opportunity to view CEVA's latest demonstration platforms, including Mobile-Media2000, encoding and decoding H.264 streams up D1 resolution at 30fps; a fully-integrated Voice-over-IP platform demo for residential gateways capable of supporting up to 8 channels; and a fully-integrated 5.1 surround sound audio platform demo targeting mobile and home applications.
"Our first CEVA Technology Symposium in Shanghai offers an ideal opportunity for China's chip and system designers to learn how they can leverage the latest DSP architectures and DSP-based software solutions to develop and deploy differentiated products for today's competitive consumer and communications markets," said Gweltaz Toquet, vice president of Asia Sales for CEVA. "We look forward to a successful event and the opportunity to further enhance the awareness of CEVA's products and services within the engineering community in China."
Registration for the Shanghai Technology Symposium is now open and can be accessed online at http://www.eccn.com/2007CEVA/Register . Alternatively, you can contact the CEVA Sales & Support office in Shanghai, China for more information. CEVA will also host a Technology Symposium in Japan in November of this year. More information will be made available closer to the event.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance
metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices. For more information, visit http://www.ceva-dsp.com/
SOURCE: CEVA, Inc.
CONTACT: Richard Kingston, CEVA, Inc., +1-408-514-2976,
firstname.lastname@example.org; or Mike Sottak, Wired Island, Ltd.,
Web site: http://www.ceva-dsp.com/