SAN JOSE, Calif. - January 10, 2005 - CEVA, Inc. (NASDAQ: CEVA;
LSE: CVA), the leading licensor of digital signal processors (DSP) cores
and communications solutions to the semiconductor industry, today launched
CEVA-TeakLite-II - a high performance DSP Core delivering outstanding cost
and power advantages required for today's consumer and wireless devices.
CEVA-TeakLite-II delivers a fully synthesizable soft core and a
process-independent design that allows licensees to specify the silicon
area, power consumption and speed that best suits their needs.

CEVA-TeakLite-II, a single Multiply-Accumulate (MAC) 16-bit fixed point
DSP core, achieves a 30% increase in performance compared to its
predecessor core, reaching 200 MHz @ TSMC 0.13u G (worst-case conditions
and process), for a fully synthesizable core. Combining superior code
compactness and small silicon die size (0.4 mm2 for the DSP engine
designed with TSMC 0.13u G process rules), CEVA-TeakLite-II is positioned
to meet the needs of advanced applications such as 2G/2.5G Wireless
Handsets, Portable Media Players, next generation Hard Disks and Optical
Drivers, and Digital Cordless Phones.

CEVA-TeakLite-II builds on the architecture of CEVA-TeakLite and
CEVA-Oak, the most established and successful DSP cores to date in CEVA's
IP portfolio. CEVA-TeakLite and CEVA-Oak cores have been licensed to 50
partners worldwide who, since inception, have shipped an estimated 500M
units of CEVA powered silicon. TeakLite-II is fully compatible to both
CEVA-TeakLite and CEVA-Oak DSPs at assembly and binary levels, allowing
its users to leverage both existing applications and the large software
installed base already available.

"With over 500 million units shipped to date, there is no question as
to the success of TeakLite powered solutions" said Gideon Wertheizer, EVP
of CEVA. "CEVA-TeakLite-II enhanced feature set and performance offers our
existing customers and future licensees the performance demanded of new
applications while maintaining legacy software and the cost effectiveness
of the TeakLite architecture."

With next generation wireless and digital media devices requiring
larger program size, increased local frame buffers and efficient
multi-tasking, CEVA-TeakLite-II further expands its predecessor's memory
addressable space by offering up to 2 mega-byte address space for code
memory and up to 2 mega-byte address space for data memory. The core
significantly reduces system-on-chip development effort and cost through
the integration of real time emulation and code trace modules, shortening
both design and verification cycles. These debug features can be further
used for field upgrades and updates. The core is complemented with a fully
automated reference design implementation along with a verification &
simulation environments - reducing both development cost and
time-to-market.

CEVA-TeakLite-II is further complemented by extensive algorithms and
applications from CEVA and the CEVAnet™ third-party development community.

About CEVA, Inc.

Headquartered in San Jose, Calif., CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including multimedia, audio, Voice over Packet (VoP), GPS location, Bluetooth, Serial Attached SCSI and Serial ATA (SATA). In 2005 CEVA's IP was shipped in over 115 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information, visit ceva-dsp.com.

A PDF copy of this press release is also available here