SAN JOSE, Calif., Oct. 9 /PRNewswire-FirstCall/ -- CEVA, Inc. (NASDAQ: CEVA)(LSE: CVA), a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications, today announced that NXP Semiconductors, the independent company founded by Philips, has chosen the CEVA-Teak™ DSP core for its highly integrated ultra low-cost single-chip solutions targeting low-cost and entry-level handset designs for emerging markets.
Leveraging the superior processing performance and low power of the CEVA-Teak DSP core for baseband and voice processing, NXP's ULC single-chip solutions, PNX4901 and PNX4903, feature fully functional and completely integrated single-chip phone solutions. These GSM/GPRS solutions provide complete system-level operation in a single monolithic IC. By providing the highest levels of integration, they represent the smallest, most cost-effective solutions available.
"We are very pleased that NXP is using CEVA-Teak DSP core for its entry-level cellular product line," said Gideon Wertheizer, CEO of CEVA. "We have established a strong record with this product line and by incorporating the CEVA-Teak DSP Core, NXP has access to an industry-leading DSP technology to meet the ever-growing development requirements in the high-volume, entry-level handset market."
"To ensure offering our customers with optimized solutions, NXP makes substantial investment in our own DSP technology, as well as works with industrial DSP leaders for appropriate solutions," said Dan Rabinovitsj, Senior VP BL Cellular of NXP Semiconductors. "The CEVA-Teak DSP core meets our requirements for baseband and voice processing capabilities, without compromising performance. Together with NXP's best-in-class RF performance, NXP's single-chip solution for the ULC market delivers the smallest bill of materials and PCB footprint, along with the lowest manufacturing and test costs, for significant savings in ULC handsets."
CEVA-Teak is a 16-bit fixed-point general-purpose DSP core. Its dual MAC architecture features high performance, high flexibility and throughput for complex DSP implementations. The core is designed for low-power, speech and audio processing, multimedia and wireless communications (GSM, CDMA, EDGE, 3G, etc.), high-speed modems, advanced telecommunication systems and various embedded control applications. CEVA-Teak is designed in consideration of low-power uses to achieve the best possible performance with the lowest possible power consumption. The core is suitable for a wide variety of battery-powered portable applications.
For more information on NXP's single-chip GSM / GPRS solution, click through http://www.nxp.com/acrobat_download/literature/9397/75015998.pdf.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices.
For more information, visit http://www.ceva-dsp.com/.
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