CEVA Low Power DSP Core Enables EoNex Modem Chip, Korea's First for CDMA2000 1x Wireless Phones

BARCELONA, Spain - 3GSM Congress - February 13, 2006 - CEVA,
Inc. (NASDAQ: CEVA; LSE: CVA), the leading licensor of digital signal
processor (DSP) cores, multimedia, GPS and storage platforms to the
semiconductor industry, today announced that its low-power CEVA-TeakLite
DSP solution is being used in production by EoNex Technologies, Inc., the
first Korean chip supplier to commercialize a cellular modem chip for the
CDMA2000 1x standard. In October last year, LG Electronics had launched a
1.3 mega pixel CDMA camera phone adopting EoNex's CDMA2000 1x modem ASIC
(called N1000) which includes embedded CEVA-powered DSP chip.

EoNex's one-stop solution package of a low-cost full-featured CDMA2000
modem chip and protocol software is ideally suited for price-sensitive
multimedia camera phones for the Asian markets.

"The CEVA-TeakLite DSP core played an important role in the successful
deployment of our latest modem chip, the N1000," said Sang Kim, vice
president of ASIC team at EoNex. "Of particular importance were the small
footprint and low-power consumption of the core, which allow EoNex-powered
CDMA phones such as the LG SD-280 camera phone to compete successfully in
price-sensitive handset markets such as Korea. We look forward to
continuing working with CEVA on our next generation of modem chips for 3G
standards and beyond."

"We are pleased to have our CEVA-TeakLite processor utilized in the
N1000 chip, helping EoNex establish itself in the CDMA2000 1x and 1xEV-DO
arena," said Gideon Wertheizer, CEO of CEVA. "Our close working
relationship with EoNex will enable them to continue to build on the
success of this chip by supporting additional standards such as
HSUPA/HSDPA and mobile WiMAX, with modem chips based on our CEVA-TeakLite
and CEVA-X1620 DSP cores."

CDMA2000 1x is a family of third-generation (3G) wireless standards
that offers enhanced voice and data capacity and higher data rates than
previous 2G wireless standards. Today, the technology has more than 165
million subscribers using 65 carriers in 47 countries (source:
3GToday.com). The availability of chips supporting CDMA2000 1x from EoNex
promises to change the market dynamics of the CDMA semiconductor industry,
particularly in Korea where that wireless standard is widely used.

The CEVA-TeakLite DSP Core is a low power, single Multiply-Accumulate
(MAC), 16- bit, Fixed point DSP core that provides various resources for
customization and differentiated configuration such as program and data
memory size and type (e.g., RAM, ROM Flash, etc.), interfaces to
DSP-related peripherals (DMA, Timer, etc.) and other system interfaces. It
has an advanced set of Digital Signal Processing instructions as well as
general microprocessor functions. CEVA-TeakLite is designed with
consideration for low-power uses to achieve the best possible performance
with the lowest possible power consumption.

About EoNex

EoNex Technologies Incorporated, founded in April 2000 in Korea,
provides wireless modem ASIC and protocol stack software products focusing
on 3G and 3.5G CDMA, EGPRS, HSUPA/HSDPA, and mobile WiMAX wireless
technologies. The company develops stable and optimized protocol stack
software that is tightly coupled with its modem ASIC products. EoNex
leverages its superior technical expertise and experience to deliver
reliable and cost-effective wireless terminal modem solutions to its
customers.

About CEVA, Inc.

Headquartered in San Jose, Calif., CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including multimedia, audio, Voice over Packet (VoP), GPS location, Bluetooth, Serial Attached SCSI and Serial ATA (SATA). In 2005 CEVA's IP was shipped in over 115 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information, visit www.ceva-dsp.com.

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A PDF copy of this press release is also available here