SAN JOSE, Calif. - September 13, 2004 - CEVA, Inc. (NASDAQ:
CEVA; LSE: CVA), the leading licensor of digital signal processors (DSP)
cores and communications solutions to the semiconductor industry, today
introduced CEVA-X System Platforms™ - low-power, highly-integrated SoC
platforms designed to reduce development costs and time-to-market for
customers who are designing next-generation DSP-powered devices. Built
around the industry-leading CEVA-X™ DSP cores, CEVA-X System Platforms are
available immediately in two ultra- low power versions:
CEVA-X System1100, a system optimized for wireless and general
purpose DSP solutions
CEVA-X System1200, a high performance DSP system, targeting a
wide range of markets including wireless communication and digital
Semiconductor designers today face escalating design costs and
timelines combined with ever increasing challenges of right-first-time
silicon. Integration and verification design flaws are predominantly
responsible for silicon failure, resulting in increased development costs
and delayed time-to-market. CEVA-X System Platforms are complete, verified
hardware platforms that reduce development efforts, mitigate the risk of
costly silicon re-spins and slash time-to-market by over 12 months.
"DSP powered solutions are the fastest growing segment of the
semiconductor market and fundamental to all next generation wireless and
digital multimedia devices," said Will Strauss, president of research
firm, Forward Concepts. "The introduction of CEVA-X System Platforms can
greatly reduce development costs, verification and time-to-market for
customers deploying CEVA-X DSP cores."
CEVA-X System Platform exploits multiple innovative power-saving
techniques such as system modules active only when needed, level-two
memory architecture and caching, adjustable DSP system speed,
decentralized interconnect topology and selective hardware/software
wake-up events. These CEVA-X System Platform power management techniques
reduce overall power dissipation by more than 50 percent.
CEVA-X System1100 is a low-cost platform optimized for wireless and
general purpose DSP solutions and includes the following main features:
Sophisticated power management unit for dynamic low-power consumption
Complete set of hardware peripherals extendible through Advanced
Peripheral Bus (APB)
connectivity through Advanced High Performance Bus (AHB) compliant
Two level memory architecture enabling shared memory between
CEVA DSP and ARM cores, reducingsystem
complexity and power consumption
unit enabling on-the-fly firmware program bypasses
CEVA-X System1200 integrates additional features that enhance the
system processing power for applications such as digital multimedia
devices and includes:
Programmable and configurable 3-D DMA co-processor
hardware accelerators to integrate customers' own extensions
and glue-less interface TDM and SPI ports for streaming audio samples
"In delivering the open, reusable and verified CEVA-X System Platforms,
our licensees can reduce their time-to-market by more than 12 months for
highly advanced next generation wireless and digital multimedia
solutions," said Chet Silvestri, President and CEO of CEVA. "Building on
our position as the market leader in DSP, CEVA-X System Platforms enable
us to provide a total solution to our customers, from cores to platforms
and from software to tools, spanning the complete design chain."
CEVA-X System Platform Web Seminar
CEVA will hold a live web seminar introducing the CEVA-X System
Platform on Tuesday, September 21st at 10:00 a.m. PT, 13:00 ET, 18:00 GMT.
The webcast will be accessible via the CEVA Website at
http://www.ceva-dsp.com. Please go to the website at least 15 minutes
prior to the call to register, and to download and install any necessary
audio software. If you cannot attend the web seminar on the day, you can
view the archived seminar after the event.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including multimedia, audio, Voice over Packet (VoP), GPS location, Bluetooth, Serial Attached SCSI and Serial ATA (SATA). In 2005 CEVA's IP was shipped in over 115 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information, visit www.ceva-dsp.com.
A PDF copy of this press release is also available here