CEVA, Inc. Announces Upcoming Schedule of Events With the Financial Community

MOUNTAIN VIEW, Calif., Aug. 30, 2011 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the mobile handset, portable and consumer electronics markets, today announced that it will participate in the following upcoming conferences:

(Logo: http://photos.prnewswire.com/prnh/20051010/CEVALOGO)

  • William Blair 4th Annual Emerging Growth Stock Conference, on September 8th in New York
  • Rodman & Renshaw Annual Global Investment Conference, on September 12th in New York
  • G8: ThinkEquity's 8th Annual Growth Conference, on September 13th in New York
  • Deutsche Bank 2011 Technology Conference, on September 14th in Las Vegas

Where available, CEVA's presentation from these conferences will be streamed via audio webcast. Please visit http://www.ceva-dsp.com/investors for more information.

About CEVA, Inc.

CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.