MOUNTAIN VIEW, Calif., May 16, 2013 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the mobile, portable and consumer electronic markets, today announced that it will participate in the following upcoming conferences:
- Barclays Global Technology, Media & Telecom Conference on May 23 in New York City, NY. CEVA's presentation from the conference will be webcast live at 4:40 p.m. Eastern.
- Benchmark Company's 4th Annual One-on-One Investor Conference on May 30 in Milwaukee, WI
- William Blair & Company's 33rd Annual Growth Stock Conference on June 12 in Chicago, IL
Where available, the company's presentation from these conferences will be streamed via audio webcast. Please visit http://www.ceva-dsp.com/investors/ for more information.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in more than 1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.