SAN JOSE, Calif., May 26 /PRNewswire-FirstCall/ -- CEVA, Inc. [(Nasdaq: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the handset, consumer electronics and portable device markets, today announced that it will participate in the following conferences in June:
- June 3 - ThinkEquity's 1st Annual Semiconductor Conference in New York, NY.
- June 3 - Sterne Agee Inaugural Technology Conference in New York, NY.
- June 9 & 10 - RBC Capital Markets Technology, Media & Communications Conference in New York, NY.
- June 22 - Fifth Annual Piper Jaffray Europe Conference in London, England.
More details for these conferences will be available in the investor relations area of CEVA's website at www.ceva-dsp.com
For more information, please contact email@example.com
About CEVA, Inc.
CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, including handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com
SOURCE CEVA, Inc.