SAN JOSE, Calif., Nov. 19 /PRNewswire-FirstCall/ -- CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications, today announced a collaboration with ROHM Co., Ltd. (Kyoto, Japan) to offer a complete reference design platform for Bluetooth 2.0+EDR. Addressing the burgeoning Bluetooth market, the combined reference design integrates ROHM's 2.0+EDR Radio with CEVA's Bluetooth 2.0+EDR baseband and protocol stack IP for a high-performance, low-power Bluetooth 2.0+EDR platform.
"CEVA's Bluetooth 2.0+EDR baseband hardware and software protocol stack IP and ROHM's 2.0+EDR Radio are already being independently integrated by mutual customers," said Paddy McWilliams, Managing Director, Communications Product Line at CEVA. "To simplify the integration process and optimize the reference design for our collective customers, we are pleased to partner with ROHM and integrate our combined Bluetooth technologies into a reference Bluetooth 2.0+EDR platform."
"The silicon performance of our Bluetooth 2.0+EDR Radio along with the CEVA-Bluetooth IP at the recent UnPlugFest revealed a very competitive combined Bluetooth solution," said Hiroshi Ohyabu, Group Manager, Digital Network Project at ROHM. "We are delighted to further co-operate with CEVA in creating this platform and address the strong demand for a complete Bluetooth 2.0+EDR reference design from our customers."
CEVA-Bluetooth 2.0+EDR IP consists of an RTL baseband engine coupled with an ANSI C software stack. It is available as a discrete IP package for use with 3rd party embedded processors or it may be licensed together with a CEVA DSP for a complete Bluetooth platform. Such a platform can be also coupled with a complete set of audio codecs, voice codecs, echo cancellation and noise suppression algorithms, yielding an integrated Bluetooth and multimedia solution.
ROHM Bluetooth 2.0+EDR Radio consists of LNA, PA, TX/RX switch, Crystal Oscillator, regulator, VCO and Digital modulator/demodulator for FSK/PSK. It is a full CMOS IC RF transceiver, offering high performance and low power consumption for 2.4GHz band Bluetooth applications. The chip is integrated to minimize the use of external components and is available in VQFN40 package (6.0mm x 6.0mm x 1.0mm, pin pitch 0.5mm).
About ROHM Co., Ltd.
ROHM CO., Ltd., established in Kyoto, Japan, in 1958, designs and manufactures integrated circuits (ICs) and other semiconductor and electronic components. ROHM's product lineup includes monolithic ICs, power modules, photo link modules, transistors, diodes, light emitting diodes (LEDs), laser diodes, resistors, capacitors, liquid crystal displays (LCDs), thermal heads,image sensor heads, LED displays and others. ROHM's corporate objective is "Quality First," and a key component of that objective is the Company's policy of securing a reasonable margin. ROHM also puts focal emphasis on environmental protection.
For more information, visit http://www.rohm.com/ About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices.
For more information, visit https://ceva-dsp.com/
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