CEVA-TeakLite DSP Core Powers High Performance EDGE Cellular Chip
San Jose, CA - December 15, 2003 - CEVA, Inc. (NASDAQ: CEVA;
LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores
and integrated applications to the semiconductor industry, today announced
that Broadcom Corporation has deployed the CEVA-TeakLite DSP Core to power
the Broadcom® BCM2132 EDGE/GPRS/GSM multimedia baseband processor chip for
the rapidly emerging EDGE (Enhanced Data for GSM Evolution) market.
Mobilink Telecom, which Broadcom acquired in 2002, licensed the
CEVA-TeakLite DSP Core. Its decision to continue developing EDGE solutions
using CEVA-TeakLite underlines CEVA's position as the leading licensor of
open, industry-standard DSP cores. CEVA is the number one licensor of DSP
technology to the semiconductor industry (Gartner-Dataquest, 2003).
"We are delighted that Broadcom, a leading provider of integrated
circuits enabling broadband communications, have chosen CEVA's low-power,
high-performance TeakLite DSP core to power their industry-leading
solution for the rapidly emerging EDGE market," said Chet Silvestri, CEO
of CEVA. "It is clear that with over 100 licensing partners choosing CEVA,
our DSP is the architecture of choice for the next generation of wireless
CEVA-TeakLite is powering Broadcom's single-chip EDGE solution that
achieves Class 12 data rates of more than 236 Kbps over GSM networks. The
chip's DSP processor together with the chipset's software/hardware
architecture, delivers low-power consumption for full four-slot EDGE
freeing processing power for a range of integrated multimedia applications
including camera, graphics engine, multiple color displays, USB, IEEE
802.11 and Bluetooth® technologies.
CEVA-TeakLite DSP is a 16-bit fixed-point general-purpose licensable
DSP core designed for low power and high-performance applications such as
cellular handsets, MP3 players, disk drive controllers, cordless phones,
VoIP terminals and various embedded control applications. CEVA-TeakLite
DSP, a fully synthesizable soft core, is process independent and easily
portable to any ASIC library.
CEVA offers an unrivalled portfolio of DSP cores beginning with
single-MAC (CEVA-TeakLite DSP) architecture to Dual-MAC (CEVA-Teak),
Dual-MAC with Instruction Level Parallelism (CEVA-Palm DSP) and the
scalable, multiple MAC and extendible architecture of CEVA-X, the latest
generation DSP architecture from CEVA.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including multimedia, audio, Voice over Packet (VoP), GPS location, Bluetooth, Serial Attached SCSI and Serial ATA (SATA). In 2005 CEVA's IP was shipped in over 115 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information, visit www.ceva-dsp.com.
A PDF copy of this press release is also available here
CEVA-TeakLite is a registered trademark of
CEVA, Inc. CEVA DSP is a trademark of CEVA, Inc. Broadcom® is a trademark
of Broadcom Corporation and/or its affiliates in the United States and
certain other countries.
Bluetooth® is a trademark of the Bluetooth SIG.
All other company or product names are the registered trademarks or
trademarks of their respective owners.