Oak Brook, IL and SAN JOSE, Calif. - Feb. 12 -- ArrayComm LLC and CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], today announced an agreement to work toward the implementation of ArrayComm’s full LTE eNodeB PHY on the CEVA-XC™ DSP core. This will provide SoC product developers with a pre-optimized PHY software/processor package to incorporate in their overall system design. This collaboration is supported by the CEVA-XCnet™ Partnership Program, of which ArrayComm is an original member.
The CEVA-XC processor is designed and optimized for high-performance, low power communications processing, with a single core capable of handling complete 4G transceiver paths fully in software. ArrayComm’s LTE eNodeB PHY is a fully scalable baseband physical layer solution incorporating ArrayComm’s industry-leading A-MAS™ multi-antenna signal processing software. Delivering these two powerful components as a pre-optimized package allows SoC developers to simultaneously reduce program costs and time to market.
“LTE requires high capacity with minimal cost, and SoC technology is the critical component for scalable LTE infrastructure platforms,” said Bruce Duysen, President of ArrayComm. “CEVA’s CEVA-XC DSP offers the highest-performance flexible processor architecture for LTE infrastructure and we are excited to partner with them to accelerate the delivery of base stations.”
“CEVA has a long history of partnering with industry-leading technology suppliers to develop market-specific, SoC products to minimize design costs and time-to-market, said Eran Briman, VP of marketing at CEVA. “Our collaboration with ArrayComm to deliver a full featured eNodeB PHY solution on our CEVA-XC DSP enables our mutual customers to enter the LTE infrastructure market with lower associated risk and cost.”
ArrayComm is a provider of physical layer solutions for wireless infrastructure and client device applications. ArrayComm is a world leader in Multi-Antenna Signal processing, delivering commercial A‑MAS™ software now that combines MIMO, beamforming, and interference cancellation to improve end user experiences and radio network economics through gains in coverage, client data rates, and system capacity. The company’s comprehensive and flexible PHY solutions include optimized DSP software and hardware accelerators that save development costs and time-to-market.
About CEVA, Inc.
CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, including handsets from all top five handset OEMs – Nokia, Samsung, LG, Motorola and Sony Ericsson. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com