TSMC 2018 OIP Ecosystem Forum and Technology Symposium Europe

On July 23, 2018, OIP Forum Day 1,
In the Solutions in AI, Automotive and Ultra Low Power Technologies track, 16:00-16:30:
Emmanuel Gresset, Business Development Director, Wireless and Wireline Communications Business Unit, CEVA, will present:
“Dragonfly Complete IP Solutions for Ultra-Low Power Dual-Mode NB-IoT and GNSS SoCs, Using Single Die RF, Processor and Embedded Flash”

https://www.regexpo.com/tsmc/eusymposium18/Exhibitor/index.html

Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam,1118BN Netherlands