Join the CEVA team at MWC-Shanghai 2019 (June 26-28) to learn how we help our customers create AI-driven, connected devices.
We will be happy to discuss your projects and how our portfolio of intelligent sensing and wireless connectivity IP platforms can help, including:
- 5G and V2X - CEVA-XC DSP based platforms for enhanced mobile broadband, fixed wireless access, automotive, and infrastructure
- Cellular IoT - Dragonfly-NB2 silicon proven reference design for complete eNB-IoT and GNSS solution
- Wireless connectivity - comprehensive connectivity solutions for IoT, mobile and access points using RivieraWaves Wi-Fi 6 and Bluetooth 5.1 platforms
- Artificial Intelligence – NeuPro AI processor family and CDNN neural network compiler for a wide range of deep learning applications
- Computer vision and imaging – CEVA-XM intelligent vision platforms for enhanced camera-enabled applications in smartphones, surveillance, drones and automotive
- Visual Positioning – CEVA-SLAM SDK for high-accuracy 3D mapping of a camera-based devices’ surroundings
- Wireless audio – Bluetooth 5.1 Dual Mode for true wireless stereo and Software ANC solution for noise free earbuds
- Voice user interface – multi-microphone reference platform using CEVA’s ClearVox noise reduction and WhisPro speech recognition, optimized for CEVA-BX low-power multipurpose DSPs
Visit us at executive meeting room EMRC30 in hall N4. Access to the meeting room is by invitation and demo and meeting appointments are filling up fast, so contact us now and a member of our team will be in touch to schedule your meeting.
We hope to see you there!
The CEVA team