Join the CEVA team at MWC-Shanghai 2021 (February 23-25) to experience the smart sensing and wireless connectivity technologies that will shape our future.
We will showcase our complete portfolio of licensable IP solutions with target applications including:
- TWS earbuds - integrated platform solution for TWS earbuds comprising Bluetooth LE/Dual Mode, Audio DSP, and complete software stack
- Immersive Audio and Conversational Assistants -immersive audio and voice experience for intelligent headsets and speakers, using 3D audio and ANC
- 5G and cellular IoT connectivity - complete solutions for 5G UE, gNB and O-RAN, as well as eNB-IoT connectivity with GNSS positioning
- Wireless IoT – scalable connectivity platforms from Bluetooth 5.2 to Wi-Fi 6
- Sensor Hub DSPs and Sensor Fusion SW – Sensor Fusion DSPs and software for complete contextual perception utilizing multiple sensors and Tiny-ML in AR/VR, smart home, robotics, and IoT
- Edge AI – AI processors and Neural Network graph compilers for deep learning-based applications
- Computer vision – vision DSPs and wide angle image processing algorithms for camera-enabled applications in smartphones, 360 degree cameras, drones, surveillance and automotive
In addition, you will have the opportunity to interact with demos and devices based on these technologies.
Visit us at Hall N4, suite EMRD01. Contact us now and a member of our team will be in touch with you to schedule your meeting.
Alternatively, if you cannot attend in person, please visit our virtual booth at any time for your online experience.