Signal processing platforms and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

CEVA-SLAM SDK

Streamlines SLAM integration in low-power embedded vision systems

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MVSILICON License and Deploy CEVA Bluetooth® IP in its latest Wireless Audio Platform
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SLAM SDK targets mobile, AR/VR and autonomous mobility
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"CEVA's industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings"

Ross Jatou
Vice President and General Manager of the Automotive Solutions Division

“The CEVA-X1 IoT processor delivers exceptional performance within the stringent power and cost constraints of NB-IoT devices”

Zhou Jin
Marketing director of Sanechips (ZTE Microelectronics)

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"

Yuval Reina
EVP Global Products and Services

“We chose CEVA’s RivieraWaves BLE technology as an important component of the Bluetooth connectivity solution of Opn due to its winning combination of market leadership, quality of IP and excellent technical support.”

Finn Möhring,
VP of R&D

“By leveraging CEVA’s DSP technology in our LTE modem design, we ensure ultra-low power consumption, critical to the successful adoption of LTE in these battery-powered devices”

Kyung-Ho Kim
Vice President of Samsung