Signal processing, sensor fusion and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

SENSE. CONNECT. INNOVATE
Join the CEVA team at CES 2020 (January 7-10)

to learn how smart sensing and wireless connectivity

are revolutionizing next generation intelligent devices.

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CEVA, Inc. Announces Third Quarter 2019 Financial Results
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'The AI Inference Processor is Dead'
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"CEVA's industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings"

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"

“The CEVA-XC DSP allowed us to quickly and seamlessly implement C-V2X support on our chipset in addition to DSRC, resulting in the world's first and only truly secure global V2X solution."

“The integration of CEVA's advanced Bluetooth Dual Mode IP into our wireless chip enables us to bring low power stereo audio streaming and data connectivity to our hearing aids, giving our customers an unparalleled user experience”

"In designing the nRF91 SoC, we were able to leverage CEVA's expertize in low power DSPs and parallel processing architecture to achieve outstanding power consumption, while retaining the flexibility to support multiple cellular IoT standards."