Signal processing, sensor fusion and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

5G Mobile and Infrastructure

Intelligent, scalable solutions for 5G, LTE, V2X and Radar

AI & Deep Learning

Harnessing neural networks to accelerate machine learning

Imaging and Computer Vision

Outstanding image quality and intelligent vision processing for embedded designs

Wireless IoT

Bluetooth, Wi-Fi and NB-IoT connectivity solutions for smart and connected devices

Audio, Voice and Speech

Voice activation, voice communication, audio processing and sound sensing

Sensor Fusion

High-precision sensor fusion algorithms for maximizing sensor performance

Let your device
see the world as you do

Image processing and sensor fusion algorithms
facilitate quality wide-angle cameras

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Upcoming Events

Jefferies 2019 Semiconductor, Hardware and Communications Infrastructure Summit
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Press Releases

CEVA, Inc. to Present at Upcoming Investor Conferences
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Latest News

CEVA invests $10 million in image processing IP
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40+ Devices

Every second

10,000,000,000+

Devices to date

We power your world!

“The CEVA-X1 IoT processor delivers exceptional performance within the stringent power and cost constraints of NB-IoT devices”

Zhou Jin
Marketing director of Sanechips (ZTE Microelectronics)

“We chose CEVA’s RivieraWaves BLE technology as an important component of the Bluetooth connectivity solution of Opn due to its winning combination of market leadership, quality of IP and excellent technical support.”

Finn Möhring,
VP of R&D

"The CEVA-XC framework is a highly renowned DSP architecture for communications processing and is ideal to meet the stringent performance requirements of next generation 4.9G and 5G base stations"

Henri Tervonen
CTO and Head of R&D Foundation, Mobile Networks

“By leveraging CEVA’s DSP technology in our LTE modem design, we ensure ultra-low power consumption, critical to the successful adoption of LTE in these battery-powered devices”

Kyung-Ho Kim
Vice President of Samsung

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"

Yuval Reina
EVP Global Products and Services