Signal processing platforms and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

Imaging and Computer Vision

Outstanding image quality and intelligent vision processing for embedded designs.

AI & Deep Learning

Harnessing neural networks to accelerate machine learning.

Connectivity

Bluetooth, Wi-Fi, LPWA, and wired connectivity solutions for smart and connected devices.

Wireless Communication

Intelligent, scalable solutions for advanced wide area networks.

Audio, Voice and Speech

Voice activation, voice communication, audio processing and sound sensing.

Always-On & Sensor Fusion

Multiple integrated sensing and instant activation at very low power

CEVA Technology Symposium 2018

 

Join us to learn how AI at the Edge is
revolutionizing smarter, connected devices.

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Upcoming Events

CEVA Technology Symposium - Hsinchu
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Press Releases

SiFlower Licenses and Deploys CEVA's 802.11ac Wi-Fi IP in its Smart Home Access Point SoC
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Latest News

Wi-Fi Alliance® introduces Wi-Fi 6
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40+ Devices

Every second

9,000,000,000+

Devices to date

We power your world!

"CEVA's industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings"

Ross Jatou
Vice President and General Manager of the Automotive Solutions Division

“We chose CEVA’s RivieraWaves BLE technology as an important component of the Bluetooth connectivity solution of Opn due to its winning combination of market leadership, quality of IP and excellent technical support.”

Finn Möhring,
VP of R&D

"The CEVA-XC framework is a highly renowned DSP architecture for communications processing and is ideal to meet the stringent performance requirements of next generation 4.9G and 5G base stations"

Henri Tervonen
CTO and Head of R&D Foundation, Mobile Networks

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"

Yuval Reina
EVP Global Products and Services

“By leveraging CEVA’s DSP technology in our LTE modem design, we ensure ultra-low power consumption, critical to the successful adoption of LTE in these battery-powered devices”

Kyung-Ho Kim
Vice President of Samsung