Signal processing platforms and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

CEVA-SLAM SDK

Streamlines SLAM integration in low-power embedded vision systems

Read more

Upcoming Events

Bluetooth Asia 2019
All Events

Press Releases

MVSILICON License and Deploy CEVA Bluetooth® IP in its latest Wireless Audio Platform
All Press Releases

Latest News

SLAM SDK targets mobile, AR/VR and autonomous mobility
All News
40+ Devices

Every second

10,000,000,000+

Devices to date

We power your world!

“By leveraging CEVA’s DSP technology in our LTE modem design, we ensure ultra-low power consumption, critical to the successful adoption of LTE in these battery-powered devices”

Kyung-Ho Kim
Vice President of Samsung

"The CEVA-XC framework is a highly renowned DSP architecture for communications processing and is ideal to meet the stringent performance requirements of next generation 4.9G and 5G base stations"

Henri Tervonen
CTO and Head of R&D Foundation, Mobile Networks

“The CEVA-X1 IoT processor delivers exceptional performance within the stringent power and cost constraints of NB-IoT devices”

Zhou Jin
Marketing director of Sanechips (ZTE Microelectronics)

"CEVA's industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings"

Ross Jatou
Vice President and General Manager of the Automotive Solutions Division

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"

Yuval Reina
EVP Global Products and Services