Signal processing, sensor fusion and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

MotionEngine™ Hear Sensor Fusion Software

Intuitive user interface, gesture control,
activity tracking and spatial audio capabilities
for hearable devices 

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5G Mobile and Infrastructure

Intelligent, scalable solutions for 5G, LTE, V2X and Radar

AI & Deep Learning

Harnessing neural networks to accelerate machine learning

Imaging and Computer Vision

Outstanding image quality and intelligent vision processing for embedded designs

Wireless IoT

Bluetooth, Wi-Fi and NB-IoT connectivity solutions for smart and connected devices

Audio, Voice and Speech

Voice activation, voice communication, audio processing and sound sensing

Sensor Fusion

High-precision sensor fusion algorithms for maximizing sensor performance

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Press Releases

CEVA's Bluetooth® Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification
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Latest News

Sensor Fusion in Hearables. A powerful complement
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"The CEVA-XC framework is a highly renowned DSP architecture for communications processing and is ideal to meet the stringent performance requirements of next generation 4.9G and 5G base stations"

“The CEVA-X1 IoT processor delivers exceptional performance within the stringent power and cost constraints of NB-IoT devices”

"In designing the nRF91 SoC, we were able to leverage CEVA's expertize in low power DSPs and parallel processing architecture to achieve outstanding power consumption, while retaining the flexibility to support multiple cellular IoT standards."

“The integration of CEVA's advanced Bluetooth Dual Mode IP into our wireless chip enables us to bring low power stereo audio streaming and data connectivity to our hearing aids, giving our customers an unparalleled user experience”

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"