Signal processing, sensor fusion and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

CEVA’s VIRTUAL booth

Visit our VIRTUAL MWC 2020 booth 

to experience CEVA’s latest

technologies and demos

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5G Mobile and Infrastructure

Intelligent, scalable solutions for 5G, LTE, V2X and Radar

AI & Deep Learning

Harnessing neural networks to accelerate machine learning

Imaging and Computer Vision

Outstanding image quality and intelligent vision processing for embedded designs

Wireless IoT

Bluetooth, Wi-Fi and NB-IoT connectivity solutions for smart and connected devices

Audio, Voice and Speech

Voice activation, voice communication, audio processing and sound sensing

Sensor Fusion

High-precision sensor fusion algorithms for maximizing sensor performance

Upcoming Events

Susquehanna Investor Conference
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Press Releases

Goodix License and Deploy CEVA Bluetooth Low Energy IP in SoCs Targeting Wearables, Mobile Devices, the...
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Latest News

CEVA’s NB-IoT IP Completes Protocol Conformance Testing using R&S Communication Tester
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40+ Devices

Every second

11,000,000,000+

Devices to date

We power your world!

"In designing the nRF91 SoC, we were able to leverage CEVA's expertize in low power DSPs and parallel processing architecture to achieve outstanding power consumption, while retaining the flexibility to support multiple cellular IoT standards."

"CEVA's industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings"

“The CEVA-X1 IoT processor delivers exceptional performance within the stringent power and cost constraints of NB-IoT devices”

"The CEVA-XC framework is a highly renowned DSP architecture for communications processing and is ideal to meet the stringent performance requirements of next generation 4.9G and 5G base stations"

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"