Signal processing, sensor fusion and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

CEVA-XC22

Most Powerful and Efficient DSP

for 5G-Advanced Massive Compute 

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CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC
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OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023
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“The integration of CEVA's advanced Bluetooth Dual Mode IP into our wireless chip enables us to bring low power stereo audio streaming and data connectivity to our hearing aids, giving our customers an unparalleled user experience”

"CEVA's industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings"

“The CEVA-XC DSP allowed us to quickly and seamlessly implement C-V2X support on our chipset in addition to DSRC, resulting in the world's first and only truly secure global V2X solution."

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"

"The CEVA-XC framework is a highly renowned DSP architecture for communications processing and is ideal to meet the stringent performance requirements of next generation 4.9G and 5G base stations"