Signal processing, sensor fusion and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

5G Mobile and Infrastructure

Intelligent, scalable solutions for 5G, LTE, V2X and Radar

AI & Deep Learning

Harnessing neural networks to accelerate machine learning

Imaging and Computer Vision

Outstanding image quality and intelligent vision processing for embedded designs

Wireless IoT

Bluetooth, Wi-Fi and NB-IoT connectivity solutions for smart and connected devices

Audio, Voice and Speech

Voice activation, voice communication, audio processing and sound sensing

Sensor Fusion

High-precision sensor fusion algorithms for maximizing sensor performance

Let your device
see the world as you do

Image processing and sensor fusion algorithms
facilitate quality wide-angle cameras

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Upcoming Events

Jefferies 2019 Semiconductor, Hardware and Communications Infrastructure Summit
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Press Releases

CEVA, Inc. to Present at Upcoming Investor Conferences
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Latest News

CEVA invests $10 million in image processing IP
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40+ Devices

Every second

10,000,000,000+

Devices to date

We power your world!

“The CEVA-X1 IoT processor delivers exceptional performance within the stringent power and cost constraints of NB-IoT devices”

Zhou Jin
Marketing director of Sanechips (ZTE Microelectronics)

"CEVA's industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings"

Ross Jatou
Vice President and General Manager of the Automotive Solutions Division

"The CEVA-XC framework is a highly renowned DSP architecture for communications processing and is ideal to meet the stringent performance requirements of next generation 4.9G and 5G base stations"

Henri Tervonen
CTO and Head of R&D Foundation, Mobile Networks

“By leveraging CEVA’s DSP technology in our LTE modem design, we ensure ultra-low power consumption, critical to the successful adoption of LTE in these battery-powered devices”

Kyung-Ho Kim
Vice President of Samsung

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"

Yuval Reina
EVP Global Products and Services