Signal processing, sensor fusion and AI processors for a smarter, connected world

Ultra-low-power platforms for deep learning, vision, audio, communication and connectivity

Intrinsix Turnkey Chip Design

Merging wireless connectivity, smart sensing

and security IP licensing with turnkey chip

design services 

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5G Mobile and Infrastructure

Intelligent, scalable solutions for 5G, LTE, V2X and Radar

AI & Deep Learning

Harnessing neural networks to accelerate machine learning

Imaging and Computer Vision

Outstanding image quality and intelligent vision processing for embedded designs

Wireless IoT

Bluetooth, Wi-Fi and NB-IoT connectivity solutions for smart and connected devices

Audio, Voice and Speech

Voice activation, voice communication, audio processing and sound sensing

Sensor Fusion

High-precision sensor fusion algorithms for maximizing sensor performance

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Linley Fall Processor Conference 2021
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Press Releases

CEVA, Inc. Schedules Third Quarter 2021 Earnings Release and Conference Call
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Latest News

Add UWB hardware and software to IC designs
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"In designing the nRF91 SoC, we were able to leverage CEVA's expertize in low power DSPs and parallel processing architecture to achieve outstanding power consumption, while retaining the flexibility to support multiple cellular IoT standards."

“The integration of CEVA's advanced Bluetooth Dual Mode IP into our wireless chip enables us to bring low power stereo audio streaming and data connectivity to our hearing aids, giving our customers an unparalleled user experience”

“The CEVA-XC DSP allowed us to quickly and seamlessly implement C-V2X support on our chipset in addition to DSRC, resulting in the world's first and only truly secure global V2X solution."

"CEVA's industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings"

"The CEVA DSPs are an important component of our strategic roadmap to quadruple the capabilities of our unique multicore technology by delivering octa-core modem processing within a silicon chip and vertically integrating it into our next generation of wireless backhaul solutions"