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CEVA-XC™ is a high-performance, low-power DSP processor designed
and optimized for advanced wireless communications processing in
mobile handsets as well as wireless infrastructure applications.
A single CEVA-XC core is capable of handling complete 3.5G and 4G
transceiver paths of in software. As a fully programmable architecture
CEVA-XC supports multiple air interfaces including LTE, WiMAX, HSPA,
alongside 3G and 2G in software.
CEVA-XC builds upon its predecessor DSP, the CEVA-X,
which is shipping in large volumes in mobile handsets and other
mobile devices from tier-1 vendors for baseband processing.
CEVA-XC is specifically designed to address the stringent power
consumption, time-to-market and cost constraints associated with
developing a high performance, next generation wireless communications
chip. Utilizing an innovative scalable and modular architecture,
CEVA-XC addresses the precise requirements of any 4G baseband design,
from handset terminals and mobile broadband modules through to wireless
infrastructure equipment.
CEVA-XC eliminates the need for heterogenic architectures composed
of multiple wireless coprocessors, accelerators or SIMD engine which
increase cost, power, time-to-market and software design complexity
in wireless SoCs. In addition, CEVA-XC is coupled with an optimizing
C compiler and application optimizer, further reducing the associated
integration efforts and costs.
CEVA-XC builds upon the architecture of the CEVA-X™
DSP by incorporating up to four modular Vector Communication Units
into the CEVA-X framework to deliver processing power of up to 200
billion operations per second. This performance level enables CEVA-XC
to support multiple LTE/WiMAX channels in a single core, surpassing
any other DSP available today for wireless infrastructure applications.
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Efficient single core solution for LTE class 5 and