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CEVA Complementary IP Partner 

Multi-Core Interconnect IP


Arteris, provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.

CEVA DSP Cores Supported

Partnering in Market Solutions

  • Mobile

Product Offering

CEVA and Arteris have collaborated to bring Arteris’ advanced FlexNoC interconnect IP together with CEVA’s industry-leading DSP cores in a highly-optimized, high performance multi-core solution.